GS880F32BGT-4.5 GSI [GSI Technology], GS880F32BGT-4.5 Datasheet
GS880F32BGT-4.5
Related parts for GS880F32BGT-4.5
GS880F32BGT-4.5 Summary of contents
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... Pb-Free 100-lead TQFP package available Functional Description Applications The GS880F18/32/36BT is a 9,437,184-bit (8,388,608-bit for x32 version) high performance synchronous SRAM with a 2-bit burst address counter. Although of a type originally developed for Level 2 Cache applications supporting high performance CPUs, the device now finds application in synchronous SRAM applications, ranging from DSP main store to networking chip set support ...
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DDQ ...
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DDQ ...
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DQP DDQ ...
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TQFP Pin Description Symbol Type I — ...
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Register A0– LBO ADV CK ADSC ADSP Power Down ZZ Control Note: Only x36 version shown for simplicity. ...
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Mode Pin Functions Mode Name Burst Order Control Output Register Control Power Down Control Note: There is a pull-down device on the ZZ pin, so this input pin can be unconnected and the chip will operate in the default states ...
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Byte Write Truth Table Function GW Read H Read H Write byte a H Write byte b H Write byte c H Write byte d H Write all bytes H Write all bytes L Notes: 1. All byte outputs are ...
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Synchronous Truth Table Address Operation Used Deselect Cycle, Power Down Deselect Cycle, Power Down Deselect Cycle, Power Down Read Cycle, Begin Burst External Read Cycle, Begin Burst External Write Cycle, Begin Burst External Read Cycle, Continue Burst Read Cycle, Continue ...
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Notes: 1. The diagram shows only supported (tested) synchronous state transitions. The diagram presumes G is tied low. 2. The upper portion of the diagram assumes active use of only the Enable (E1, E2, and E3) and Write (B trol ...
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Notes: 1. The diagram shows supported (tested) synchronous state transitions plus supported transitions that depend upon the use Use of “Dummy Reads” (Read Cycles with G High) may be used to make the transition from read cycles ...
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Absolute Maximum Ratings (All voltages reference Symbol DDQ V I/O V Voltage on Other Input Pins IN I Input Current on Any Pin IN I Output Current on Any I/O Pin OUT P ...
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V Range Logic Levels DDQ3 Parameter V Input High Voltage DD V Input Low Voltage DD V I/O Input High Voltage DDQ V I/O Input Low Voltage DDQ Notes: 1. The part numbers of Industrial Temperature Range versions end the ...
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Undershoot Measurement and Timing 50% V – 2 50% tKC Capacitance 2 Parameter Input Capacitance Input/Output Capacitance Note: ...
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DC Electrical Characteristics Parameter Input Leakage Current (except mode pins) ZZ Input Current FT, SCD, ZQ Input Current Output Leakage Current Output High Voltage Output High Voltage Output Low Voltage Rev: 1.02 10/2004 Specifications cited are subject to change without ...
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Absolute Maximum Ratings (All voltages reference Symbol DDQ V I/O V Voltage on Other Input Pins IN I Input Current on Any Pin IN I Output Current on Any I/O Pin OUT P ...
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V Range Logic Levels DDQ3 Parameter V Input High Voltage DD V Input Low Voltage DD V I/O Input High Voltage DDQ V I/O Input Low Voltage DDQ Notes: 1. The part numbers of Industrial Temperature Range versions end the ...
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Undershoot Measurement and Timing 50% V – 2 50% tKC Capacitance 2 Parameter Input Capacitance Input/Output Capacitance Note: ...
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DC Electrical Characteristics Parameter Input Leakage Current (except mode pins) ZZ Input Current FT, SCD, ZQ Input Current Output Leakage Current Output High Voltage Output High Voltage Output Low Voltage Rev: 1.02 10/2004 Specifications cited are subject to change without ...
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Operating Currents Parameter Test Conditions (x32/ Device Selected; x36) All other inputs Operating ≥V or ≤ V Current IH IL (x18) Output open Standby ZZ ≥ V – 0.2 V — DD Current Device Deselected; Deselect All other inputs — ...
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AC Electrical Characteristics Parameter Clock Cycle Time Clock to Output Valid Clock to Output Invalid Flow Through Clock to Output in Low-Z Setup time Hold time Clock HIGH Time Clock LOW Time Clock to Output in High Output ...
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Begin Read A Cont tKH tKH CK ADSP tS tH ADSC tS tH ADV tS tH A0– Ba– and E3 only sampled with ADSC tOE ...
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... During normal operation, ZZ must be pulled low, either by the user or by its internal pull down resistor. When ZZ is pulled high, the SRAM will enter a Power Sleep mode after 2 cycles. At this time, internal state of the SRAM is preserved. When ZZ returns to low, the SRAM operates normally after ZZ recovery time. ...
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TQFP Package Drawing (Package T) Symbol Description Min. Nom. Max A1 Standoff 0.05 A2 Body Thickness 1.35 b Lead Width 0.20 c Lead Thickness 0.09 D Terminal Dimension 21.9 D1 Package Body 19.9 E Terminal Dimension 15.9 E1 Package Body ...
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Ordering Information for GSI Synchronous Burst RAMs 1 Org Part Number 512K x 18 GS880F18BT-4.5 512K x 18 GS880F18BT-5 512K x 18 GS880F18BT-5.5 512K x 18 GS880F18BT-6.5 512K x 18 GS880F18BT-7.5 256K x 32 GS880F32BT-4.5 256K x 32 GS880F32BT-5 256K ...
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... GS880F36BGT-7.5 512K x 18 GS880F18BGT-4.5I 512K x 18 GS880F18BGT-5I 512K x 18 GS880F18BGT-5.5I 512K x 18 GS880F18BGT-6.5I 512K x 18 GS880F18BGT-7.5I 256K x 32 GS880F32BGT-4.5I 256K x 32 GS880F32BGT-5I 256K x 32 GS880F32BGT-5.5I 256K x 32 GS880F32BGT-6.5I 256K x 32 GS880F32BGT-7.5I 256K x 36 GS880F36BGT-4.5I 256K x 36 GS880F36BGT-5I 256K x 36 GS880F36BGT-5 ...
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... Sync SRAM Datasheet Revision History DS/DateRev. Code: Old; New 880F18B_r1 880F18B_r1; 880F18B_r1_01 880F18B_r1_01; 880F18B_r1_02 Rev: 1.02 10/2004 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. Types of Changes Format or Content • Creation of new datasheet • Removed erroneous speed bins Content/Format • ...