LIS302DL_08 STMICROELECTRONICS [STMicroelectronics], LIS302DL_08 Datasheet - Page 40

• Manufacturer Part Number: LIS302DL_08
• Manufacturer: STMICROELECTRONICS [STMicroelectronics]

Package information
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Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Figure 26. LGA 14: mechanical data and package dimensions
DIM.
A1
A2
A3
D1
E1
N1
P1
P2
L1
T1
T2
N
R
e
d
h
k
s
i
0.180
2.850
4.850
0.965
0.640
0.750
0.450
1.200
MIN.
0.920
0.220
3.000
5.000
0.800
0.300
4.000
1.360
1.200
0.975
0.650
0.800
0.500
0.150
0.050
0.100
0.100
TYP.
mm
MAX.
1.000
0.700
0.260 0.0071 0.0087 0.0102
3.150 0.1122 0.1181 0.1240
5.150 0.1909 0.1968 0.2027
0.985 0.0380 0.0384 0.0386
0.660 0.0252 0.0256 0.0260
0.850 0.0295 0.0315 0.0335
0.550 0.0177 0.0197 0.0217
1.600 0.0472
MIN.
0.0362 0.0394
0.0315
0.0118
0.1575
0.0535
0.0472
0.0059
0.0020
0.0039
0.0039
TYP.
inch
0.0275
0.0630
MAX.
LGA14 (3x5x0.92mm) Pitch 0.8mm
Land Grid Array Package
MECHANICAL DATA
OUTLINE AND
7773587 C
LIS302DL