LIS3L06AL_06 STMICROELECTRONICS [STMicroelectronics], LIS3L06AL_06 Datasheet
LIS3L06AL_06
Related parts for LIS3L06AL_06
LIS3L06AL_06 Summary of contents
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Features ■ 2.4V to 3.6V single supply operation ■ Low power consumption ± ± ■ 2g/ 6g user selectable full-scale ■ 0.5mg resolution over 100hz bandwidth ■ Embedded self test ■ Output voltage, offset ...
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Contents Contents 1 Block Diagram & Pins Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.1 Block ...
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LIS3L06AL 1 Block Diagram & Pins Description 1.1 Block diagram Figure 1. Block Diagram a SELF TEST 1.2 Pin Description Figure 2. Pin Connection X Y DIRECTION OF THE DETECTABLE ACCELERATIONS X+ CHARGE Y+ AMPLIFIER Z+ MUX ...
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Block Diagram & Pins Description Table 1. Pin description Pin # Pin Name Reserved 4/17 ST Self Test (Logic 0: normal mode; Logic 1: Self-test) Voutz Output Voltage Z channel GND 0V ...
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LIS3L06AL 2 Mechanical and Electrical Specifications 2.1 Mechanical Characteristics. Table 2. Mechanical Characteristics (Temperature range -40°C to +85°C) All the parameters are specified @ Vdd =3.3V 25°C unless otherwise noted Symbol Parameter (3) Ar Acceleration Range (4) So ...
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Mechanical and Electrical Specifications Table 2. Mechanical Characteristics (Temperature range -40°C to +85°C) All the parameters are specified @ Vdd =3.3V 25°C unless otherwise noted Symbol Parameter Operating Temperature Top Range Wh Product Weight 1. The product is ...
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LIS3L06AL 2.3 Absolute maximum ratings Stresses above those listed as “absolute maximum ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device under these conditions is not implied. Exposure to ...
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Mechanical and Electrical Specifications Self Test allows to test the mechanical and electric part of the sensor, allowing the seismic mass to be moved by means of an electrostatic test-force. The Self Test function is off when the ST pin ...
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LIS3L06AL 3 Functionality The LIS3L06AL is a high performance, low-power, analog output 3-axis linear accelerometer packaged in a LGA package. The complete device includes a sensing element and an IC interface able to take the information from the sensing element ...
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Application hints 4 Application hints Figure 3. LIS3L06AL Electrical Connection Vdd 10µF 100nF GND GND ST GND Digital signals Power supply decoupling capacitors (100nF ceramic or polyester + 10µF Aluminum) should be placed as near as possible to the device ...
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LIS3L06AL 4.1 Soldering information The LGA-8 package is compliant with the ECOPACK,RoHs and “Green” standard.It is qualified for soldering heat resistance according to JEDEC J-STD-020C. Pin 1 indicator is electrically connected to ST pin. Leave pin 1 indicator unconnected during ...
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Typical performance characteristics 5 Typical performance characteristics 5.1 Mechanical Characteristics at 25°C Figure 5. x-axis Zero-g level at 3. 1.55 1.6 1.65 Zero−g Level (V) Figure 7. y-axis Zero-g ...
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LIS3L06AL 5.2 Mechanical Characteristics derived from measurement in the -40°C to +85°C temperature range Figure 11. x-axis Zero-g level change Vs temperature −1 −0.5 0 Zero−g level change (mg/deg. C) Figure 13. ...
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Typical performance characteristics 5.3 Electrical characteristics at 25°C Figure 17. Noise density at 3.3V (x,y axis Noise density (ug/sqrt(Hz)) Figure 19. Current Consumption at 3. ...
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LIS3L06AL 6 Package Information In order to meet environmental requirements, ST offers these devices in ECOPACK packages. These packages have a Lead-free second level interconnect. The category of second Level Interconnect is marked on the package and on the inner ...
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Revision history 7 Revision history Table 6. Document revision history Date 28-Sep-2005 03-May-2006 16/17 Revision 1 Initial release. 2 Corrected typo errors. Applied new corporate template layout. LIS3L06AL Changes ...
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LIS3L06AL Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at ...