EMIF03-SIM02F2_08 STMICROELECTRONICS [STMicroelectronics], EMIF03-SIM02F2_08 Datasheet - Page 6

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EMIF03-SIM02F2_08

Manufacturer Part Number
EMIF03-SIM02F2_08
Description
3-line IPAD, EMI filter including ESD protection
Manufacturer
STMICROELECTRONICS [STMicroelectronics]
Datasheet
Ordering information
Note:
5
6/8
Figure 16. Flip Chip tape and reel specification
More information isavailable in the application notes:
AN1235:"Flip Chip: Package description and recommendations for use"
AN1751: “EMI filters: Recommendations and measurements”
Ordering information
Table 3.
Figure 14. Footprint
EMIF03-SIM02F2
340 µm min for 315 µm copper pad diameter
Order code
Solder mask opening recommendation:
250 µm recommended, 300 µm max
Solder stencil opening: 330 µm
Copper pad Diameter:
Ordering information
All dimensions in mm
Marking
0.73 ± 0.05
GJ
Dot identifying Pin A1 location
Package
Flip Chip
Figure 15. Marking
User direction of unreeling
2.65 mg
4 ± 0.1
Weight
1.52
Dot, ST logo
xx = marking
z = manufacturing location
yww = datecode
4 ± 0.1
(y = year
ww = week)
Ø 1.5 ± 0.1
Base qty
5000
x
y
EMIF03-SIM02F2
w
x
Tape and reel 7”
Delivery mode
E
w
z

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