LPC1313FHN33/01,51 NXP Semiconductors, LPC1313FHN33/01,51 Datasheet - Page 50

• Manufacturer Part Number: LPC1313FHN33/01,51
• Description: ARM Microcontrollers - MCU CortexM3 32bit 32KB
• Manufacturer: NXP Semiconductors

Specifications of LPC1313FHN33/01,51

• Rohs: yes
• Core: ARM Cortex M3
• Processor Series: LPC1313
• Data Bus Width: 32 bit
• Maximum Clock Frequency: 72 MHz
• Program Memory Size: 32 KB
• Data Ram Size: 8 KB
• On-chip Adc: Yes
• Operating Supply Voltage: 2 V to 3.6 V
• Package / Case: HVQFN-33
• Mounting Style: SMD/SMT
• Factory Pack Quantity: 4000

NXP Semiconductors
10. Dynamic characteristics
Table 13.
T
[1]
[2]
LPC1311_13_42_43
Product data sheet
Symbol
N
t
t
t
ret
er
prog
amb
endu
Number of program/erase cycles.
Programming times are given for writing 256 bytes from RAM to the flash. Data must be written to the flash in blocks of 256 bytes.
= −40 °C to +85 °C, unless otherwise specified.
Flash characteristics
10.1 Power-up ramp conditions
10.2 Flash memory
Parameter
endurance
retention time
erase time
programming time
Table 12.
T
[1]
[2]
Symbol Parameter
t
t
V
r
wait
amb
Fig 25. Power-up ramp
I
See
The wait time specifies the time the power supply must be at levels below 400 mV before ramping up.
= −40 °C to +85 °C.
Figure
Condition: 0 < V
rise time
wait time
input voltage
Power-up characteristics
25.
All information provided in this document is subject to legal disclaimers.
Conditions
powered
unpowered
sector or multiple
consecutive sectors
I
≤ 400 mV at start of power-up (t = t
400 mV
Rev. 5 — 6 June 2012
Conditions
at t = t
at t = t
V
DD
0
1
1
: 0 < V
on pin V
I
≤ 400 mV
DD
t = t
[1]
[2]
1
32-bit ARM Cortex-M3 microcontroller
Min
10000
10
20
95
0.95
1
LPC1311/13/42/43
)
t
wait
[1][2]
t
r
[1]
002aag001
Min
0
12
0
Typ
100000
-
-
100
1
Typ
-
-
-
© NXP B.V. 2012. All rights reserved.
Max
-
-
-
105
1.05
Max
500
-
400
50 of 74
Unit
ms
μs
mV
Unit
cycles
years
years
ms
ms