74LVC2G241GN,115 NXP Semiconductors, 74LVC2G241GN,115 Datasheet - Page 2

• Manufacturer Part Number: 74LVC2G241GN,115
• Description: Buffers & Line Drivers Dual buffer line driver 3-state
• Manufacturer: NXP Semiconductors

Specifications of 74LVC2G241GN,115

• Rohs: yes
• Factory Pack Quantity: 5000

NXP Semiconductors
3. Ordering information
Table 1.
4. Marking
Table 2.
[1]
74LVC2G241
Product data sheet
Type number
74LVC2G241DP
74LVC2G241DC
74LVC2G241GT
74LVC2G241GF
74LVC2G241GD
74LVC2G241GM
74LVC2G241GN
74LVC2G241GS
Type number
74LVC2G241DP
74LVC2G241DC
74LVC2G241GT
74LVC2G241GF
74LVC2G241GD
74LVC2G241GM
74LVC2G241GN
74LVC2G241GS
The pin 1 indicator is located on the lower left corner of the device, below the marking code.
Ordering information
Marking codes
Package
Temperature range Name
−40 °C to +125 °C
−40 °C to +125 °C
−40 °C to +125 °C
−40 °C to +125 °C
−40 °C to +125 °C
−40 °C to +125 °C
−40 °C to +125 °C
−40 °C to +125 °C
All information provided in this document is subject to legal disclaimers.
TSSOP8
VSSOP8
XSON8
XSON8
XSON8U
XQFN8
XSON8
XSON8
Rev. 12 — 22 June 2012
Description
plastic thin shrink small outline package; 8 leads;
body width 3 mm; lead length 0.5 mm
plastic very thin shrink small outline package; 8 leads;
body width 2.3 mm
plastic extremely thin small outline package; no leads;
8 terminals; body 1 × 1.95 × 0.5 mm
extremely thin small outline package; no leads;
8 terminals; body 1.35 × 1 × 0.5 mm
plastic extremely thin small outline package; no leads;
8 terminals; UTLP based; body 3 × 2 × 0.5 mm
plastic, extremely thin quad flat package; no leads;
8 terminals; body 1.6 × 1.6 × 0.5 mm
extremely thin small outline package; no leads;
8 terminals; body 1.2 × 1.0 × 0.35 mm
extremely thin small outline package; no leads;
8 terminals; body 1.35 × 1.0 × 0.35 mm
Marking code
V241
V41
V41
V1
V41
V41
V1
V1
[1]
Dual buffer/line driver; 3-state
74LVC2G241
© NXP B.V. 2012. All rights reserved.
Version
SOT505-2
SOT765-1
SOT833-1
SOT1089
SOT996-2
SOT902-2
SOT1116
SOT1203
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