74LVTN16244BBX,518 NXP Semiconductors, 74LVTN16244BBX,518 Datasheet
74LVTN16244BBX,518
Specifications of 74LVTN16244BBX,518
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74LVTN16244BBX,518 Summary of contents
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V 16-bit buffer/driver; 3-state Rev. 5 — 2 April 2012 1. General description The 74LVTN16244B is a high-performance BiCMOS product designed for V at 3.3 V. This device is a 16-bit buffer and line driver featuring non-inverting 3-state ...
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... NXP Semiconductors 4. Functional diagram 1A0 1Y0 47 2 1A1 1Y1 46 3 1A2 1Y2 44 5 1A3 1Y3 43 6 1OE 1 2A0 2Y0 41 8 2A1 2Y1 40 9 2A2 2Y2 38 11 2A3 2Y3 37 12 2OE 48 Pin numbers are shown for TSSOP48 package only. Fig 1. Logic symbol ...
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... NXP Semiconductors 5. Pinning information 5.1 Pinning Fig 3. Pin configuration SOT362-1 (TSSOP48) 74LVTN16244B Product data sheet 74LVTN16244B 1 1OE 1Y0 2 1Y1 3 GND 4 5 1Y2 6 1Y3 2Y0 8 2Y1 9 10 GND 11 2Y2 2Y3 12 3Y0 13 3Y1 14 15 GND 16 3Y2 3Y3 4Y0 19 20 4Y1 21 GND ...
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... NXP Semiconductors terminal 1 index area (1) This is not a supply pin, the substrate is attached to this pad using conductive die attach material. There is no electrical or mechanical requirement to solder this pad however soldered the solder land should remain floating or be connected to GND. Fig 4. Pin configuration SOT1134-2 (HXQFN60) 5 ...
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... NXP Semiconductors Table 2. Pin description …continued Symbol Pin SOT362-1 GND 4, 10, 15, 21, 28, 34, 39 18, 31 1A0 to 1A3 47, 46, 44, 43 2A0 to 2A3 41, 40, 38, 37 3A0 to 3A3 36, 35, 33, 32 4A0 to 4A3 30, 29, 27 Functional description [1] Table 3. Function table Control nOE [ HIGH voltage level ...
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... NXP Semiconductors Table 4. Limiting values …continued In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter P total power dissipation tot [1] The input and output negative voltage ratings may be exceeded if the input and output clamp current ratings are observed. ...
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... NXP Semiconductors 9. Static characteristics Table 6. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter = 40 C to +85 C [1] T amb V input clamping voltage IK V HIGH-level output voltage LOW-level output voltage input leakage current I I power-off leakage current V ...
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... NXP Semiconductors 10. Dynamic characteristics Table 7. Dynamic characteristics Voltages are referenced to GND (ground = 0 V); for test circuit see Symbol Parameter = 40 C to +85 C [1] T amb t LOW to HIGH PLH propagation delay t HIGH to LOW PHL propagation delay t OFF-state to HIGH PZH propagation delay t OFF-state to LOW ...
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... NXP Semiconductors 11. Waveforms Measurements points are given in V and V are typical voltage output levels that occur with the output load Fig 5. Propagation delay input (nAn) to output (nYn) nOE input nYn output nYn output Measurements points are given in V and V are typical voltage output levels that occur with the output load. ...
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... NXP Semiconductors Test data is given in Table Definitions test circuit Load resistance Load capacitance including jig and probe capacitance Termination resistance should be equal to output impedance External voltage for measuring switching times. EXT Fig 7. Test circuit for measuring switching times Table 9 ...
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... NXP Semiconductors 12. Package outline TSSOP48: plastic thin shrink small outline package; 48 leads; body width 6 pin 1 index 1 DIMENSIONS (mm are the original dimensions). A UNIT max. 0.15 1.05 mm 1.2 0.25 0.05 0.85 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. ...
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... NXP Semiconductors HXQFN60: plastic compatible thermal enhanced extremely thin quad flat package; no leads; 60 terminals; body 0.5 mm terminal 1 index area A10 terminal 1 index area Dimensions Unit max ...
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... NXP Semiconductors 13. Abbreviations Table 10. Abbreviations Acronym Description BiCMOS Bipolar Complementary Metal Oxide Semiconductor DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model TTL Transistor-Transistor Logic 14. Revision history Table 11. Revision history Document ID Release date 74LVTN16244B v.5 20120402 • Modifications: For type number 74LVTN16244BBX the sot code has changed to SOT1134-2 ...
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... Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... Product data sheet NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ ...
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... NXP Semiconductors 17. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 5 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 6 Functional description . . . . . . . . . . . . . . . . . . . 5 7 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 8 11 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11 13 Abbreviations ...