FM25L256-DGCTR Cypress Semiconductor, FM25L256-DGCTR Datasheet - Page 14

• Manufacturer Part Number: FM25L256-DGCTR
• Description: F-RAM 256K (32Kx8) 2.7V
• Manufacturer: Cypress Semiconductor

Specifications of FM25L256-DGCTR

• Product Category: F-RAM
• Rohs: yes
• Memory Size: 256 KB
• Organization: 32 K x 8
• Interface: SPI
• Operating Supply Voltage: 2.7 V to 3.6 V
• Operating Temperature Range: 0 C to + 70 C
• Mounting Style: SMD/SMT
• Package / Case: DFN-8
• Factory Pack Quantity: 3000

Revision History
Rev. 2.4 (obsolete)
Feb. 2009
Revision
0.11
0.12
0.13
0.1
1.0
1.1
1.2
2.0
2.1
2.2
2.3
2.4
2/5/2009
12/9/03
8/12/04
9/21/04
7/20/05
9/14/05
3/26/07
9/9/03
1/7/04
5/5/04
3/9/05
4/5/05
Date
Summary
Initial release.
Reduced I
Added t
diagram.
Changed t
and t
table.
Added DFN mechanical package drawing and ordering information. Added
I
Changed t
Changed I
diagram.
Removed “preliminary” from DFN package drawing. Added note about
powering down with /CS active (pg 3). Added ESD and package MSL
ratings.
Changed to Pre-Production status.
Split into commercial and industrial datasheets. Added recommended pcb
footprint to DFN package drawing. Changed DFN marking scheme.
Added power up note to Power Cycle Timing table. Package name change,
from DFN to TDFN.
Not recommended for new designs. Use FM25L256B as an alternative.
Changed status to obsolete.
SB
limits at various temperatures. Changed AC timing reference to 0.5 V
VF
conditions. Changed voltage/temperature conditions in AC Parameters
VR
DD
OD
ODV
DD
and t
, t
spec limits.
spec. New rev. number to comply with new scheme.
ODV
limits. Added Power Down timing parameter and changed
VF
, and t
specs, “green” package, and modified Power Cycling
LZ
timing specs. Changed I
FM25L256 Commercial Temp.
SB
spec limit. Changed t
Page 14 of 14
DD
VR
.