STM8S103F3M6TR STMicroelectronics, STM8S103F3M6TR Datasheet - Page 104

• Manufacturer Part Number: STM8S103F3M6TR
• Description: 8-bit Microcontrollers - MCU Access line 8-bit MCU 8Kb
• Manufacturer: STMicroelectronics

Specifications of STM8S103F3M6TR

• Rohs: yes

Thermal characteristics
12
104/117
Thermal characteristics
The maximum chip junction temperature (T
Operating
The maximum chip-junction temperature, T
the following equation:
T
Where:
•
•
•
•
•
Symbol
Θ
Θ
Θ
Θ
Θ
Θ
(1)
convection environment.
Jmax
JA
JA
JA
JA
JA
JA
Thermal resistances are based on JEDEC JESD51-2 with 4-layer PCB in a natural
T
Θ
P
P
power.
P
Where: P
V
Amax
Dmax
INTmax
I/Omax
OH
JA
= T
/I
is the package junction-to-ambient thermal resistance in °C/W
OH
Amax
is the maximum ambient temperature in °C
is the sum of P
conditions.
represents the maximum power dissipation on output pins
is the product of I
of the I/Os at low and high level in the application.
I/Omax
+ (P
Parameter
Thermal resistance junction-ambient
TSSOP20 - 4.4 mm
Thermal resistance junction-ambient
SO20W (300 mils)
Thermal resistance junction-ambient
UFQFPN20 - 3 x 3 mm
Thermal resistance junction-ambient
LQFP32 - 7 x 7 mm
Thermal resistance junction-ambient
UFQFPN32 - 5 x 5 mm
Thermal resistance junction-ambient
SDIP32 - 400 mils
=Σ (V
Dmax
x Θ
OL
INTmax
*I
(1)
JA
DD
OL
Table 58: Thermal characteristics
)
) + Σ((V
andV
DocID15441 Rev 9
and P
DD
I/Omax
DD
, expressed in Watts. This is the maximum chip internal
-V
OH
Jmax
J max
(PDmax = P
)*I
, in degrees Celsius, may be calculated using
OH
) must never exceed the values given in
STM8S103K3 STM8S103F3 STM8S103F2
), taking into account the actual V
INTmax
+ P
Value
I/Omax
84
91
90
60
38
60
)
Unit
OL
°C/W
/I
OL and