STPS30L30DJF-TR STMicroelectronics, STPS30L30DJF-TR Datasheet

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STPS30L30DJF-TR

Manufacturer Part Number
STPS30L30DJF-TR
Description
Schottky Diodes & Rectifiers High Effeciency PWR Schottky Diode
Manufacturer
STMicroelectronics
Datasheet

Specifications of STPS30L30DJF-TR

Product Category
Schottky Diodes & Rectifiers
Rohs
yes
Product
Schottky Diodes
Peak Reverse Voltage
30 V
Forward Continuous Current
30 A
Max Surge Current
250 A
Configuration
Single
Forward Voltage Drop
0.51 V
Maximum Reverse Leakage Current
0.75 mA
Operating Temperature Range
- 25 C to + 150 C
Mounting Style
SMD/SMT
Package / Case
PowerFLAT

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Features
Description
Single Schottky rectifier suited for switch mode
power supply and high frequency DC to DC
converters.
Packaged in PowerFLAT™ 5x6, this device is
intended for use in low voltage high frequency
inverters.
TM: PowerFLAT is a trademark of STMicroelectronics
March 2012
This is information on a product in full production.
Low forward voltage drop
Very small conduction losses
Negligible switching losses
Avalanche rated
Extremely fast switching
Low thermal resistance
1 mm package thickness
ECOPACK
®
2 compliant component
Doc ID 022946 Rev 1
High efficiency power Schottky diode
Table 1.
K
Symbol
T
A
A
V
V
I
j
F
F(AV)
(max)
RRM
(typ)
Device summary
STPS30L30DJF
A
PowerFLAT 5x6
STPS30L30DJF
Datasheet
K
150 °C
production data
0.30 V
Value
30 A
30 V
K
A
www.st.com
1/7
7

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STPS30L30DJF-TR Summary of contents

Page 1

... March 2012 This is information on a product in full production. STPS30L30DJF High efficiency power Schottky diode Table 1. Device summary Symbol I F(AV) V RRM T (max (typ) F Doc ID 022946 Rev 1 Datasheet production data PowerFLAT 5x6 STPS30L30DJF Value 150 °C 0.30 V 1/7 www.st.com 7 ...

Page 2

... 125 ° ° 125 ° < (RMS) Doc ID 022946 Rev 1 STPS30L30DJF Value 110 ° sinusoidal 250 µ °C 1300 <1 µs, T < 150 ° < ...

Page 3

... STPS30L30DJF Figure 1. Average forward power dissipation versus average forward current P F(AV) ( =0.2 =0.1 =0. F(AV) ( Figure 3. Normalized avalanche power derating versus pulse duration ARM p P (1µs) ARM 1 0.1 0.01 t (µs) p 0.001 0.01 0.1 1 Figure 5. Relative variation of thermal impedance, junction to case, versus pulse duration Z th(j-c) /R th(j-c) 1 ...

Page 4

... V R (V) 0.1 100 0.0 Figure 10. Reverse safe operating area Epoxy printed board FR4 15.0 copper thickness = 35 µm 13.0 11.0 9.0 7.0 5.0 3 Doc ID 022946 Rev 1 STPS30L30DJF Forward voltage drop versus forward current T =125°C j (Maximum values) T =125°C j (Typical values) T =25°C j (Maximum values) 0.1 0.2 0.3 0.4 0.5 (t < 1 µs and T < ...

Page 5

... STPS30L30DJF 2 Package information Epoxy meets UL94,V0 Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ® ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ® ECOPACK trademark. Table 5. ...

Page 6

... Ordering information Figure 12. Tape and reel specifications Dot identifying Pin A1 location 0.30 1.20 All dimensions are typical values Ordering information Table 6. Ordering information Order code STPS30L30DJF-TR 4 Revision history Table 7. Document revision history Date 16-Mar-2012 6/7 2.0 6.30 User direction of unreeling Marking Package PS30 L30 PowerFLAT 5x6 0.095 g ...

Page 7

... STPS30L30DJF Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...

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