OM7628/BGA7027/9/5,598 NXP Semiconductors, OM7628/BGA7027/9/5,598 Datasheet
OM7628/BGA7027/9/5,598
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OM7628/BGA7027/9/5,598 Summary of contents
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BGA7027 400 MHz to 2700 MHz 0.5 W high linearity silicon amplifier Rev. 2 — 26 November 2010 1. Product profile 1.1 General description The BGA7027 MMIC is a one-stage amplifier, offered in a low-cost surface-mount package. It delivers 28 ...
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... NXP Semiconductors 2. Pinning information Table 2. Pin [1] This pin is DC-coupled and requires an external DC-blocking capacitor. [2] The center metal base of the SOT89 also functions as heatsink for the power amplifier. 3. Ordering information Table 3. Type number BGA7027 4. Functional diagram Fig 1. BGA7027 Product data sheet 400 MHz to 2700 MHz 0 ...
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... NXP Semiconductors 5. Limiting values Table 4. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol i(RF) T case ESD [1] Withstands switching between zero and maximum P 6. Thermal characteristics Table 5. Symbol R th(j-c) 7. Static characteristics Table 6. Input and output impedances matched to 50 unless otherwise specified ...
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... NXP Semiconductors Table 7. Input and output impedances matched to 50 application circuit; unless otherwise specified. Symbol Parameter P L(1dB) IP3 out [1] Operation outside this range is possible but not guaranteed. [2] Defined dBm per tone; spacing = 1 MHz Scattering parameters Table 8. ...
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... NXP Semiconductors Table 8. Scattering parameters, MMIC only 165 mA case f (MHz Magnitude Angle (ratio) (degree) 1800 0.94 147 1900 0.94 146 2000 0.94 146 2100 0.93 146 2200 0.93 147 2300 0.93 147 2400 0.92 147 2500 0.91 147 2600 0.91 148 2700 0.89 147 10. Reliability information Table 9 ...
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... NXP Semiconductors 12. Application information 12.1 920 MHz to 960 MHz L2 C10 50 Ω MSL1 MSL2 MSL3 C1 C2 See Table 11 for a list of components. PCB board specification: Rogers RO4003C; Height = 0.508 mm; Fig 2. 920 MHz to 960 MHz application schematic 32 P L(1dB) (dBm 0.92 0.93 0. C. ...
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... NXP Semiconductors ISL in out (dB) −10 −20 −30 0.92 0.93 0. C. T case ( ( out (3) ISL. Fig 5. Input return loss, output return loss and isolation as a function of frequency 0 ACPR (dBc) −20 −40 (1) (2) (3) −60 (4) − 2-carrier W-CDMA; each carrier according to 3GPP test model 1 ...
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... NXP Semiconductors (1) Upper sideband (2) Lower sideband Fig 9. J1 MSL1 RF in See Table 11 for a list of components. Fig 10. 920 MHz to 960 MHz application reference board BGA7027 Product data sheet 400 MHz to 2700 MHz 0.5 W high linearity silicon amplifier 55 IP3 O (dBm 940 MHz; tone spacing = 1 MHz. ...
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... NXP Semiconductors Table 11. List of components of 920 MHz to 960 MHz See Figure 2 and Figure 10 for component layout. Printed-Circuit Board (PCB): Rogers RO4003C stack; height = 0.508 mm; copper plating thickness = 35 Component Description Value C1, C6 capacitor capacitor 5 capacitor 2 capacitor 1 capacitor 3 ...
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... NXP Semiconductors 12.2 1930 MHz to 1990 MHz 50 Ω MSL1 C1 MSL2 C8 L2 See Table 12 for a list of components. PCB board specification: Rogers RO4003C; Height = 0.508 mm; Fig 11. 1930 MHz to 1990 MHz application schematic 32 P L(1dB) (dBm 1.93 1. C. (1) T case = 85 C. (2) T case = ...
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... NXP Semiconductors ISL in out (dB) −10 −20 −30 1.93 1. C. T case ( ( out (3) ISL. Fig 14. Input return loss, output return loss and isolation as a function of frequency J1 MSL1 RF in See Table 12 for a list of components. Fig 16. 1930 MHz to 1990 MHz application reference board ...
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... NXP Semiconductors Table 12. List of components of 1930 MHz to 1990 MHz See Figure 11 and Figure 16 for component layout. Printed-Circuit Board (PCB): Rogers RO4003C stack; height = 0.508 mm; copper plating thickness = 35 Component Description Value C1, C4 capacitor capacitor 2 capacitor 2 capacitor capacitor 100 nF 10 ...
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... NXP Semiconductors 32 P L(1dB) (dBm 2.11 2. C. (1) T case = 85 C. (2) T case = 40 C. (3) T case Fig 18. Output power gain compression as a function of frequency ISL in out (dB) −10 −20 −30 2.11 2. C. T case ( ( out (3) ISL. Fig 20. Input return loss, output return loss and ...
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... NXP Semiconductors 0 ACPR (dBc) −20 (1) −40 (2) (3) (4) −60 − 2-carrier W-CDMA; each carrier according to 3GPP test model 1; 64 DPCH; PAR for composite signal = 7.5 dB; 5 MHz carrier spacing. ( 2110 MHz; ACPR measured at f 5 MHz ( 2170 MHz; ACPR measured at f 5 MHz ( 2110 MHz ...
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... NXP Semiconductors J1 MSL1 RF in See Table 13 for a list of components. Fig 25. 2110 MHz to 2170 MHz application reference board BGA7027 Product data sheet 400 MHz to 2700 MHz 0.5 W high linearity silicon amplifier MSL2 C2 MSL3 All information provided in this document is subject to legal disclaimers. ...
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... NXP Semiconductors Table 13. List of components of 2110 MHz to 2170 MHz See Figure 17 and Figure 25 for component layout. Printed-Circuit Board (PCB): Rogers RO4003C stack; height = 0.508 mm; copper plating thickness = 35 Component Description Value C1, C4 capacitor capacitor 2 capacitor 2 capacitor capacitor 100 nF 10 ...
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... NXP Semiconductors 13. Package outline Plastic surface-mounted package; exposed die pad for good heat transfer; 3 leads DIMENSIONS (mm are the original dimensions) UNIT 1.6 0.48 0.53 1.8 mm 1.4 0.35 0.40 1.4 OUTLINE VERSION IEC SOT89 Fig 27. Package outline SOT89 BGA7027 Product data sheet 400 MHz to 2700 MHz 0.5 W high linearity silicon amplifier ...
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... NXP Semiconductors 14. Abbreviations Table 14. Acronym 3GPP CPE DPCH ESD HTOL IMD3 ISM MMIC MoCA RFID W-CDMA W-LAN 15. Revision history Table 15. Revision history Document ID Release date BGA7027 v.2 20101126 • Modifications: The status of this data sheet has been changed to Product data sheet • ...
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... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...
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... NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any 17. Contact information For more information, please visit: ...
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... NXP Semiconductors 18. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . 3 7 Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 3 9 Scattering parameters . . . . . . . . . . . . . . . . . . . . 4 10 Reliability information . . . . . . . . . . . . . . . . . . . . 5 11 Moisture sensitivity ...