OM7627/BGA7127/19/5,598 NXP Semiconductors, OM7627/BGA7127/19/5,598 Datasheet
OM7627/BGA7127/19/5,598
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OM7627/BGA7127/19/5,598 Summary of contents
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BGA7127 400 MHz to 2700 MHz 0.5 W high linearity silicon amplifier Rev. 3 — 3 December 2010 1. Product profile 1.1 General description The MMIC is a one-stage amplifier, offered in a low-cost leadless surface-mount package. It delivers 28 ...
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... NXP Semiconductors 2. Pinning information 2.1 Pinning Fig 1. 2.2 Pin description Table 2. Symbol n.c. V CC(RF) V CC(BIAS) SHDN RF_IN ICQ_ADJ GND [1] This pin is DC-coupled and requires an external DC-blocking capacitor. [2] RF decoupled. [3] The center metal base of the SOT908-1 also functions as heatsink for the power amplifier. 3. Ordering information Table 3 ...
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... NXP Semiconductors 4. Functional diagram 6 SHDN RF_IN 7 INPUT MATCH Fig 2. Functional diagram 5. Shutdown control Table 4. Shutdown control settings Mode Mode description Idle medium power MMIC fully off; minimal supply current TX medium power MMIC transmit mode shutdown control disabled BGA7127 Product data sheet 400 MHz to 2700 MHz 0 ...
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... NXP Semiconductors 6. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V RF supply voltage CC(RF) V bias supply voltage CC(BIAS) I supply current CC V shutdown control voltage ctrl(sd input power i(RF) T case temperature case T junction temperature j V electrostatic discharge voltage ...
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... NXP Semiconductors 7. Thermal characteristics Table 6. Symbol R th(j-mb) [1] Defined as thermal resistance from junction to GND pad. 8. Static characteristics Table 7. Input and output impedances matched 5 Symbol Parameter I CC [1] The supply current is adjustable. See information”. [2] See 8.1 Supply current adjustment The supply current can be adjusted by changing the value of external ICQ resistor (R2). ...
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... NXP Semiconductors 9. Dynamic characteristics Table 8. Dynamic characteristics Input and output impedances matched to 50 ° 180 mA see CC case Symbol Parameter f frequency G power gain p P output power gain compression L(1dB) IP3 output third-order intercept point O NF noise figure RL input return loss ...
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... NXP Semiconductors 9.1 Scattering parameters Table 9. Scattering parameters, MMIC only 180 mA case f (MHz Magnitude Angle (ratio) (degree) 400 0.92 178 500 0.91 176 600 0.91 174 700 0.91 172 800 0.91 170 900 0.91 167 1000 0.90 165 1100 0.90 163 1200 0.90 161 1300 0.91 159 1400 0 ...
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... NXP Semiconductors 12. Application information 12.1 920 MHz to 960 MHz 180 Ω MSL1 MSL2 MSL3 C1 C2 See Table 12 for a list of components. PCB board specification: Rogers RO4003C; height = 0.508 mm; ε Fig 5. 920 MHz to 960 MHz application schematic 32 P L(1dB) (dBm ...
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... NXP Semiconductors ISL in out (dB) −5 (2) −10 −15 −20 (3) −25 −30 (1) −35 0.92 0.93 0. °C. T case ( (2) RL out (3) ISL Fig 8. Input return loss, output return loss and isolation as a function of frequency 0 ACPR (dBc) −20 −40 (1) (2) (2) (3) (4) −60 − 2-carrier W-CDMA; each carrier according to 3GPP test model 1 ...
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... NXP Semiconductors (1) Upper sideband (2) Lower sideband Fig 12. Output third-order intercept point as a function of output power per tone J1 MSL1 RF in See Table 12 for a list of components. Fig 13. 920 MHz to 960 MHz application reference board BGA7127 Product data sheet 400 MHz to 2700 MHz 0.5 W high linearity silicon amplifier ...
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... NXP Semiconductors Table 12. 920 MHz to 960 MHz list of components See Figure 5 and Figure 13 for component layout. Printed-Circuit Board (PCB): Rogers RO4003C stack; height = 0.508 mm; copper plating thickness = 35 Component Description Value C1, C4 capacitor capacitor 9 capacitor 5 capacitor μF C6 capacitor 10 μ ...
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... NXP Semiconductors 12.2 1930 MHz to 1990 MHz 180 mA 50 Ω MSL1 C1 MSL2 C2 See Table 13 for a list of components. PCB board specification: Rogers RO4003C; height = 0.508 mm; ε Fig 14. 1930 MHz to 1990 MHz application schematic 32 P L(1dB) (dBm 1.93 1. °C (1) T case = 85 ° ...
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... NXP Semiconductors ISL in out (dB) (1) −10 (2) (3) −20 −30 1.93 1. °C. T case ( (2) RL out (3) ISL Fig 17. Input return loss, output return loss and isolation as a function of frequency J1 MSL1 RF in See Table 13 for a list of components. Fig 19. 1930 MHz to 1990 MHz application reference board ...
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... NXP Semiconductors Table 13. 1930 MHz to 1990 MHz list of components See Figure 14 and Figure 19 for component layout. Printed-Circuit Board (PCB): Rogers RO4003C stack; height = 0.508 mm; copper plating thickness = 35 Component Description Value C1,C4 capacitor capacitor 2 capacitor 1 capacitor capacitor 100 nF 10 μF ...
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... NXP Semiconductors 32 P L(1dB) (dBm 2.11 2. °C (1) T case = 85 °C (2) T case = −40 °C (3) T case Fig 21. Output power gain compression as a function of frequency ISL in out (dB) −10 −20 −30 2.11 2. °C. T case ( (2) RL out (3) ISL Fig 23. Input return loss, output return loss and ...
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... NXP Semiconductors 0 ACPR (dBc) −20 −40 (1) (2) (2) (3) (4) −60 − 2-carrier W-CDMA; each carrier according to 3GPP test model 1; 64 DPCH; PAR for composite signal = 7.5 dB; 5 MHz carrier spacing. ( 2110 MHz; ACPR measured at f ± 5 MHz ( 2170 MHz; ACPR measured at f ± 5 MHz ( 2110 MHz ...
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... NXP Semiconductors J1 MSL1 RF in See Table 14 for a list of components. Fig 28. 2110 MHz to 2170 MHz application reference board Table 14. 2110 MHz to 2170 MHz list of components See Figure 20 and Figure 28 for component layout. Printed-Circuit Board (PCB): Rogers RO4003C stack; height = 0.508 mm; copper plating thickness = 35 ...
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... NXP Semiconductors 12.4 2405 MHz to 2485 MHz 180 mA 50 Ω MSL1 MSL2 C1 L1 See Table 15 for a list of components. PCB board specification: Rogers RO4003C; height = 0.508 mm; ε Fig 29. 2405 MHz to 2485 MHz application schematic 32 P L(1dB) (dBm 2.405 2.425 2.445 = 25 ° ...
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... NXP Semiconductors ISL in out (dB) −10 −20 −30 2.405 2.425 2.445 = 25 °C. T case ( (2) RL out (3) ISL Fig 32. Input return loss, output return loss and isolation as a function of frequency J1 MSL1 RF in See Table 15 for a list of components. Fig 34. 2405 MHz to 2485 MHz application reference board ...
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... NXP Semiconductors Table 15. 2405 MHz to 2485 MHz list of components See Figure 29 and Figure 34 for component layout. Printed-Circuit Board (PCB): Rogers RO4003C stack; height = 0.508 mm; copper plating thickness = 35 Component Description Value C1,C4 capacitor capacitor 1 capacitor 1 capacitor capacitor 100 nF 10 μF ...
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... NXP Semiconductors 13. Package outline HVSON8: plastic thermal enhanced very thin small outline package; no leads; 8 terminals; body 0. terminal 1 index area terminal 1 index area DIMENSIONS (mm are the original dimensions) (1) A UNIT max. 0.05 0 0.2 0.00 0.2 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. ...
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... NXP Semiconductors 14. Abbreviations Table 16. Acronym 3GPP CPE DC DPCH ESD HTOL ISM MMIC MoCA RFID SMA TX W-CDMA WLAN 15. Revision history Table 17. Revision history Document ID Release date BGA7127 v.3 20101203 • Modifications: • • • • BGA7127 v.2 20100913 BGA7127 v.1 20100726 BGA7127 Product data sheet 400 MHz to 2700 MHz 0 ...
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... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...
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... NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ ...
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... NXP Semiconductors 18. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 2.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3 5 Shutdown control . . . . . . . . . . . . . . . . . . . . . . . 3 6 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . 5 8 Static characteristics 8.1 Supply current adjustment . . . . . . . . . . . . . . . . 5 9 Dynamic characteristics ...