OM7625/BGA7124/9/3,598 NXP Semiconductors, OM7625/BGA7124/9/3,598 Datasheet
OM7625/BGA7124/9/3,598
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OM7625/BGA7124/9/3,598 Summary of contents
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BGA7124 400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier Rev. 3 — 9 September 2010 1. Product profile 1.1 General description The BGA7124 MMIC is a one-stage amplifier, available in a low-cost leadless surface-mount package. It delivers ...
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... NXP Semiconductors 2. Pinning information 2.1 Pinning Fig 1. 2.2 Pin description Table 2. Symbol n.c. V CC(RF) V CC(BIAS) SHDN RF_IN ICQ_ADJ GND [1] This pin is DC-coupled and requires an external DC-blocking capacitor. [2] RF decoupled. [3] The center metal base of the SOT908-1 also functions as heatsink for the power amplifier. 3. Ordering information Table 3 ...
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... NXP Semiconductors 4. Functional diagram 6 SHDN RF_IN 7 INPUT MATCH Fig 2. Functional diagram 5. Shutdown control Table 4. Shutdown control settings Mode Mode description Idle medium power MMIC fully off; minimal supply current TX medium power MMIC transmit mode shutdown control disabled BGA7124 Product data sheet 400 MHz to 2700 MHz 0 ...
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... NXP Semiconductors 6. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V RF supply voltage CC(RF) V bias supply voltage CC(BIAS) I supply current CC V shutdown control voltage ctrl(sd input power i(RF) T case temperature case T junction temperature j V electrostatic discharge voltage ...
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... NXP Semiconductors 7. Thermal characteristics Table 6. Symbol R th(j-mb) [1] defined as thermal resistance from junction to GND paddle. 8. Static characteristics Table 7. Input and output impedances matched to 50 values at V Symbol Parameter I CC [1] The supply current is adjustable; see [2] See 8.1 Supply current adjustment The supply current can be adjusted by changing the value of external ICQ resistor (R2); ...
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... NXP Semiconductors 170 I CC (mA) 130 1.6 2.0 2.4 2.8 3 supply voltage. Fig 4. Supply current as a function of the value Dynamic characteristics Table 8. Characteristics at V Input and output impedances matched to 50 ° 130 mA see CC case Symbol Parameter f frequency G power gain ...
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... NXP Semiconductors Table 8. Characteristics at V Input and output impedances matched to 50 ° 130 mA see CC case Symbol Parameter RL input return loss in RL output return loss out [1] Operation outside this range is possible but not guaranteed. [ 150 mA; see Section 12 “Application CC [ dBm per tone ...
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... NXP Semiconductors Table 9. Characteristics at V Input and output impedances matched to 50 ° 130 mA see CC case Symbol Parameter f frequency G power gain p P output power gain compression f = 940 MHz L(1dB) IP3 output third-order intercept point O NF noise figure RL input return loss ...
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... NXP Semiconductors 9.1 Scattering parameters Table 10. Scattering parameters MMIC only 130 mA case f (MHz Magnitude Angle (ratio) (degree) 400 0.85 161.56 500 0.90 159.44 600 0.90 152.15 700 0.89 145.75 800 0.88 139.33 900 0.87 133.19 1000 0.87 127.07 1100 0.87 120.67 1200 0.87 114.18 1300 ...
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... NXP Semiconductors Table 11. Scattering parameters at 3.3 V, MMIC only 130 mA case f (MHz Magnitude Angle (ratio) (degree) 400 0.84 161.94 500 0.91 159.25 600 0.90 151.98 700 0.90 145.57 800 0.89 139.18 900 0.88 132.87 1000 0.88 126.78 1100 0.87 120.46 1200 0.87 113.94 1300 0.87 107.48 1400 0.87 100.69 1500 0 ...
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... NXP Semiconductors 12. Application information 12 applications 12.1.1 920 MHz to 960 MHz V 50 Ω MSL1 MSL2 MSL3 See Table 14 for a list of components. PCB board specification: Rogers RO4003C; Height = 0.508 mm; ε Fig 5. 5 V/130 mA application schematic; 920 MHz to 960 MHz 30 P L(1dB) ...
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... NXP Semiconductors ISL in out (dB) RL out − −20 ISL −30 0.92 0.93 0. °C. T case Fig 8. Input return loss, output return loss and isolation as a function of frequency J1 MSL1 RF in See Table 14 for a list of components. Fig 10. 5 V/130 mA application reference board; 920 MHz to 960 MHz ...
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... NXP Semiconductors Table 14. 5 V/130 mA application list of components; 920 MHz to 960 MHz See Figure 5 and Figure 10 for component layout. Printed-Circuit Board (PCB): Rogers RO4003C stack; height = 0.508 mm; μ copper plating thickness = 35 m. Component Description C1, C6 capacitor C2, C3 capacitor C4 capacitor C5 capacitor C7 capacitor ...
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... NXP Semiconductors 12.1.2 1930 MHz to 1990 MHz 50 Ω MSL1 MSL2 See Table 15 for a list of components. PCB board specification: Rogers RO4003C; Height = 0.508 mm; ε Fig 11. 5 V/130 mA application schematic; 1930 MHz to 1990 MHz 30 P L(1dB) (dBm) 28 (1) 26 ( 1.93 1.95 = −40 °C. ...
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... NXP Semiconductors ISL in out (dB) −10 RL out RL in −20 ISL −30 1.93 1. °C. T case Fig 14. Input return loss, output return loss and isolation as a function of frequency J1 MSL1 RF in See Table 15 for a list of components. Fig 16. 5 V/130 mA application reference board; 1930 MHz to 1990 MHz ...
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... NXP Semiconductors Table 15. 5 V/130 mA application list of components; 1930 MHz to 1990 MHz See Figure 11 and Figure 16 for component layout. Printed-Circuit Board (PCB): Rogers RO4003C stack; height = 0.508 mm; μ copper plating thickness = 35 m. Component Description C1, C4 capacitor C2 capacitor C3 capacitor C5 capacitor C6 capacitor C7 capacitor ...
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... NXP Semiconductors 30 P L(1dB) (dBm 2.11 2.13 = −40 °C. (1) T case = 25 °C. (2) T case = 85 °C. (3) T case Fig 18. Output power gain compression as a function of frequency ISL in out (dB) −10 −20 −30 2.11 2. °C. T case Fig 20. Input return loss, output return loss and ...
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... NXP Semiconductors J1 MSL1 RF in See Table 16 for a list of components. Fig 22. 5 V/130 mA application reference board; 2110 MHz to 2170 MHz Table 16. 5 V/130 mA application list of components; 2110 MHz to 2170 MHz See Figure 17 and Figure 22 for component layout. Printed-Circuit Board (PCB): Rogers RO4003C stack; height = 0.508 mm; ...
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... NXP Semiconductors Table 16. 5 V/130 mA application list of components; 2110 MHz to 2170 MHz See Figure 17 and Figure 22 for component layout. Printed-Circuit Board (PCB): Rogers RO4003C stack; height = 0.508 mm; μ copper plating thickness = 35 m. Component Description Value 1.14 mm × 0.8 mm × 10.95 mm output match [1] MSL6 micro stripline 0 Ω ...
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... NXP Semiconductors 26 P L(1dB) (dBm) (3) 24 (2) ( 2.405 2.425 2.445 = −40 °C. (1) T case = 25 °C. (2) T case = 85 °C. (3) T case Fig 24. Output power gain compression as a function of frequency ISL in out (dB) − −20 ISL RL out −30 2.405 2 ...
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... NXP Semiconductors J1 MSL1 RF in See Table 17 for a list of components. Fig 28. 5 V/130 mA application reference board; 2405 MHz to 2485 MHz Table 17. 5 V/130 mA application list of components; 2405 MHz to 2485 MHz See Figure 23 and Figure 28 for component layout. Printed-Circuit Board (PCB): Rogers RO4003C stack; height = 0.508 mm; ...
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... NXP Semiconductors Table 17. 5 V/130 mA application list of components; 2405 MHz to 2485 MHz See Figure 23 and Figure 28 for component layout. Printed-Circuit Board (PCB): Rogers RO4003C stack; height = 0.508 mm; μ copper plating thickness = 35 m. Component Description [1] MSL5 micro stripline R1 resistor R2 resistor (trimmer) 2 kΩ ...
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... NXP Semiconductors 30 P L(1dB) (dBm 0.92 0.93 0.94 = −40 °C. (1) T case = 25 °C. (2) T case = 85 °C. (3) T case Fig 30. Output power gain compression as a function of frequency ISL in out (dB) RL out − −20 ISL −30 0.92 0.93 0. °C. T case Fig 32. Input return loss, output return loss and ...
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... NXP Semiconductors J1 MSL1 RF in See Table 18 for a list of components. Fig 34. 3.3 V/130 mA application reference board; 920 MHz to 960 MHz Table 18. 3.3 V/130 mA application list of components; 920 MHz to 960 MHz See Figure 29 and Figure 34 for component layout. Printed-Circuit Board (PCB): Rogers RO4003C stack; height = 0.508 mm; ...
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... NXP Semiconductors Table 18. 3.3 V/130 mA application list of components; 920 MHz to 960 MHz See Figure 29 and Figure 34 for component layout. Printed-Circuit Board (PCB): Rogers RO4003C stack; height = 0.508 mm; μ copper plating thickness = 35 m. Component Description [1] MSL6 micro stripline [1] MSL7 micro stripline [1] MSL8 micro stripline ...
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... NXP Semiconductors 26 P L(1dB) (dBm 2.405 2.425 2.445 = −40 °C. (1) T case = 25 °C. (2) T case = 85 °C. (3) T case Fig 36. Output power gain compression as a function of frequency ISL in out (dB −10 −20 ISL RL out −30 2.405 2.425 2.445 = 25 ° ...
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... NXP Semiconductors J1 MSL1 RF in See Table 19 for a list of components. Fig 40. 3.3 V/130 mA application reference board; 2405 MHz to 2485 MHz Table 19. 3.3 V/130 mA application list of components; 2405 MHz to 2485 MHz See Figure 35 and Figure 40 for component layout. Printed-Circuit Board (PCB): Rogers RO4003C stack; height = 0.508 mm; ...
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... NXP Semiconductors Table 19. 3.3 V/130 mA application list of components; 2405 MHz to 2485 MHz See Figure 35 and Figure 40 for component layout. Printed-Circuit Board (PCB): Rogers RO4003C stack; height = 0.508 mm; μ copper plating thickness = 35 m. Component Description [1] MSL5 micro stripline R1 resistor R2 resistor (trimmer) 2 kΩ ...
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... NXP Semiconductors 13. Package outline HVSON8: plastic thermal enhanced very thin small outline package; no leads; 8 terminals; body 0. terminal 1 index area terminal 1 index area DIMENSIONS (mm are the original dimensions) (1) A UNIT max. 0.05 0 0.2 0.00 0.2 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. ...
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... NXP Semiconductors 14. Abbreviations Table 20. Acronym CPE DC ESD HTOL ISM MMIC MoCA RFID SMA TX WLAN 15. Revision history Table 21. Revision history Document ID Release date BGA7124 v.3 20100909 • Modifications: • • • • • BGA7124 v.2 20100623 BGA7124 v.1 20100421 BGA7124 Product data sheet 400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier ...
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... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...
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... NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any 17. Contact information For more information, please visit: ...
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... NXP Semiconductors 18. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 2.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3 5 Shutdown control . . . . . . . . . . . . . . . . . . . . . . . 3 6 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . 5 8 Static characteristics 8.1 Supply current adjustment . . . . . . . . . . . . . . . . 5 9 Dynamic characteristics ...