OM7617/BGM1014,598 NXP Semiconductors, OM7617/BGM1014,598 Datasheet
OM7617/BGM1014,598
Specifications of OM7617/BGM1014,598
Related parts for OM7617/BGM1014,598
OM7617/BGM1014,598 Summary of contents
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BGM1014 MMIC wideband amplifier Rev. 2 — 19 September 2011 1. Product profile 1.1 General description Silicon Monolithic Microwave Integrated Circuit (MMIC) wideband amplifier with internal matching circuit in a 6-pin SOT363 SMD plastic package. CAUTION This device is sensitive ...
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... NXP Semiconductors 2. Pinning information Table 2. Pin Ordering information Table 3. Type number BGM1014 4. Marking Table 4. Type number BGM1014 5. Limiting values Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol tot T stg Recommended operating conditions Table 6 ...
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... NXP Semiconductors 7. Thermal characteristics Table 7. Thermal characteristics Symbol Parameter R thermal resistance from junction to solder point th(j-sp) 8. Characteristics Table 8. Characteristics 21.1 mA measured on demo board; unless otherwise specified Symbol Parameter V DC supply voltage S I supply current S s 2 insertion power gain 21 ...
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... NXP Semiconductors Table 8. Characteristics …continued 21.1 mA measured on demo board; unless otherwise specified Symbol Parameter IP3 input third order intercept point in IP3 output third order intercept point GHz out IM2 second order intermodulation distortion Fig 1. BGM1014 ...
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... NXP Semiconductors 180° 21.1 mA Fig 2. Output reflection coefficient ( (dB) −10 −20 −30 −40 −50 0 1000 I = 21.1 mA 2 Fig 3. Isolation ( function of frequency; 12 typical values BGM1014 Product data sheet 90° +1 135° ...
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... NXP Semiconductors (dBm −5 −40 − GHz ( Fig 5. Load power as a function of drive power at 1 GHz; typical values 5 NF (dB) 4.5 (1) (2) (3) 4 3.5 0 500 1000 = 50 ( 5 ( ...
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... NXP Semiconductors 9. Application information Figure 9 internally matched to 50 and therefore does not need any external matching. Good impedance matching is also achieved with a 75 load. The value of the input and output DC blocking capacitors C1 and C2 should be not more than 100 pF for applications above 100 MHz ...
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... NXP Semiconductors Figure 10 Fig 10. Printed-circuit board layout and component view for typical application Table 9. Component C1 BGM1014 Product data sheet shows the PCB layout used for the typical application Material = FR4; thickness = 0.6 mm; List of components used for the typical application ...
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... NXP Semiconductors Table 10. Scattering parameters 21.1 mA dBm (MHz) Magnitude Angle (ratio) (deg) 100 0.287 16.1 3.9 200 0.328 28.8 400 0.319 50.3 600 0.299 68.6 800 0.272 84.7 1000 0.243 98.9 1200 0.225 106.9 1400 0.229 ...
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... NXP Semiconductors 10. Package outline Plastic surface-mounted package; 6 leads y 6 pin 1 index DIMENSIONS (mm are the original dimensions UNIT max 1.1 0.30 0.25 mm 0.1 0.8 0.20 0.10 OUTLINE VERSION IEC SOT363 Fig 11. Package outline SOT363 (SC-88) BGM1014 Product data sheet scale ...
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... Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Package outline drawings have been updated to the latest version. ...
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... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...
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... NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ ...
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... NXP Semiconductors 14. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Recommended operating conditions Thermal characteristics . . . . . . . . . . . . . . . . . . 3 8 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 9 Application information Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10 11 Revision history ...