MT48H16M32LFCM-6 IT:B Micron Technology Inc, MT48H16M32LFCM-6 IT:B Datasheet - Page 14

• Manufacturer Part Number: MT48H16M32LFCM-6 IT:B
• Description: IC SDRAM 512MBIT 166MHZ 90VFBGA
• Manufacturer: Micron Technology Inc
• Type: Mobile SDRAMr

Specifications of MT48H16M32LFCM-6 IT:B

• Format - Memory: RAM
• Memory Type: Mobile SDRAM
• Memory Size: 512M (16M x 32)
• Speed: 166MHz
• Interface: Parallel
• Voltage - Supply: 1.7 V ~ 1.95 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 90-VFBGA
• Organization: 16Mx32
• Density: 512Mb
• Address Bus: 15b
• Maximum Clock Rate: 166MHz
• Operating Supply Voltage (typ): 1.8V
• Package Type: VFBGA
• Operating Temp Range: -40C to 85C
• Operating Supply Voltage (max): 1.95V
• Operating Supply Voltage (min): 1.7V
• Supply Current: 105mA
• Pin Count: 90
• Mounting: Surface Mount
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Compliant, Lead free / RoHS Compliant

Figure 6: 90-Ball VFBGA (10mm x 13mm)
PDF: 09005aef82ea3742
512mb_mobile_sdram_y47m.pdf – Rev. H 12/09 EN
Solder ball
material: SAC105.
Dimensions apply
to solder balls post-
reflow on Ø0.4
SMD ball pads.
11.2 CTR
Seating
0.12 A
90X Ø0.45
plane
0.8 TYP
A
Note:
9 8
1. 1. All dimensions are in millimeters.
7
6.4 CTR
10 ±0.1
3 2
1
512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM
0.65 ±0.1
0.8 TYP
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
14
13 ±0.1
Ball A1 ID
Micron Technology, Inc. reserves the right to change products or specifications without notice.
0.25 MIN
1.0 MAX
Package Dimensions
© 2007 Micron Technology, Inc. All rights reserved.
Ball A1 ID