BZA962AVL T/R NXP Semiconductors, BZA962AVL T/R Datasheet - Page 3

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BZA962AVL T/R

Manufacturer Part Number
BZA962AVL T/R
Description
TVS Diode Arrays DIODE ARRAY TAPE-7
Manufacturer
NXP Semiconductors
Series
BZA900AVLr
Datasheet

Specifications of BZA962AVL T/R

Product Category
TVS Diode Arrays
Rohs
yes
Polarity
Unidirectional
Channels
4 Channels
Operating Voltage
6.51 V
Peak Surge Current
0.85 A
Mounting Style
SMD/SMT
Termination Style
SMD/SMT
Dimensions
1.3 (Max) mm W x 1.7 (Max) mm L
Package / Case
SOT-665
Peak Pulse Power Dissipation
6 W
Factory Pack Quantity
4000
Part # Aliases
BZA962AVL,115
NXP Semiconductors
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
Notes
1. DC working current limited by P
2. Device mounted on standard printed-circuit board.
ESD STANDARDS COMPLIANCE
THERMAL CHARACTERISTICS
Note
1. Solder point of common anode (pin 2).
2003 Oct 20
Per diode
I
I
I
P
P
T
T
ESD
IEC 61000-4-2, level 4 (ESD)
HBM MIL-Std 883, class 3
R
R
Z
F
FSM
SYMBOL
SYMBOL
stg
j
tot
ZSM
Quadruple low capacitance ESD
suppressor
th j-a
th j-s
working current
continuous forward current
non-repetitive peak forward current
total power dissipation
non repetitive peak reverse power
dissipation
storage temperature
junction temperature
electrostatic discharge
thermal resistance from junction to
ambient
thermal resistance from junction to
solder point; note 1
STANDARD
PARAMETER
PARAMETER
tot(max)
.
T
T
t
T
square pulse; t
IEC 61000-4-2 (contact discharge) 15
HBM MIL-Std 883
all diodes loaded
one diode loaded
all diodes loaded
>15 kV (air); >8 kV (contact discharge)
>4 kV
p
amb
amb
amb
= 1 ms; square pulse
= 25 °C
= 25 °C
= 25 °C; note 2; see Fig.5
3
CONDITIONS
CONDITIONS
p
= 1 ms
CONDITIONS
BZA900AVL series
−65
10
MIN.
VALUE
370
135
125
Product data sheet
note 1
200
3.5
335
6
+150
150
MAX.
UNIT
K/W
K/W
K/W
mA
mA
A
mW
W
°C
°C
kV
kV
UNIT

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