M29W320DT70ZE6F NUMONYX, M29W320DT70ZE6F Datasheet - Page 15

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M29W320DT70ZE6F

Manufacturer Part Number
M29W320DT70ZE6F
Description
IC FLASH 32MBIT 70NS 48TFBGA
Manufacturer
NUMONYX
Series
Axcell™r
Datasheet

Specifications of M29W320DT70ZE6F

Format - Memory
FLASH
Memory Type
FLASH - Nor
Memory Size
32M (4Mx8, 2Mx16)
Speed
70ns
Interface
Parallel
Voltage - Supply
2.7 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Package / Case
48-TFBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
M29W320DT70ZE6F
Manufacturer:
Micron Technology Inc
Quantity:
10 000
3
3.1
3.2
3.3
3.4
3.5
Bus operations
There are five standard bus operations that control the device. These are Bus Read, Bus
Write, Output Disable, Standby and Automatic Standby. See
operations, for a summary. Typically glitches of less than 5ns on Chip Enable or Write
Enable are ignored by the memory and do not affect bus operations.
Bus Read
Bus Read operations read from the memory cells, or specific registers in the Command
Interface. A valid Bus Read operation involves setting the desired address on the Address
Inputs, applying a Low signal, V
Enable High, V
AC
becomes valid.
Bus Write
Bus Write operations write to the Command Interface. A valid Bus Write operation begins by
setting the desired address on the Address Inputs. The Address Inputs are latched by the
Command Interface on the falling edge of Chip Enable or Write Enable, whichever occurs
last. The Data Inputs/Outputs are latched by the Command Interface on the rising edge of
Chip Enable or Write Enable, whichever occurs first. Output Enable must remain High, V
during the whole Bus Write operation. See
and
Output Disable
The Data Inputs/Outputs are in the high impedance state when Output Enable is High, V
Standby
When Chip Enable is High, V
Inputs/Outputs pins are placed in the high-impedance state. To reduce the Supply Current to
the Standby Supply Current, I
Standby current level see
During program or erase operations the memory will continue to use the Program/Erase
Supply Current, I
Automatic Standby
If CMOS levels (V
more the memory enters Automatic Standby where the internal Supply Current is reduced to
the Standby Supply Current, I
Read operation is in progress.
Waveforms, and
Table 13
and
IH
. The Data Inputs/Outputs will output the value, see
CC3
Table
CC
, for Program or Erase operations until the operation completes.
Table 12: Read AC
± 0.2V) are used to drive the bus and the bus is inactive for 300ns or
14, Write AC Characteristics, for details of the timing requirements.
Table 11: DC
IH
CC2
CC2
, the memory enters Standby mode and the Data
IL
, Chip Enable should be held within V
. The Data Inputs/Outputs will still output data if a Bus
, to Chip Enable and Output Enable and keeping Write
Characteristics.
Characteristics, for details of when the output
Figure 10
and
Figure
Table 2
11, Write AC waveforms,
and
Figure 9: Read Mode
CC
Table
± 0.2V. For the
3, Bus
15/56
IH
IH
.
,

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