M29W320DT70ZE6F NUMONYX, M29W320DT70ZE6F Datasheet - Page 48

no-image

M29W320DT70ZE6F

Manufacturer Part Number
M29W320DT70ZE6F
Description
IC FLASH 32MBIT 70NS 48TFBGA
Manufacturer
NUMONYX
Series
Axcell™r
Datasheet

Specifications of M29W320DT70ZE6F

Format - Memory
FLASH
Memory Type
FLASH - Nor
Memory Size
32M (4Mx8, 2Mx16)
Speed
70ns
Interface
Parallel
Voltage - Supply
2.7 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Package / Case
48-TFBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
M29W320DT70ZE6F
Manufacturer:
Micron Technology Inc
Quantity:
10 000
Appendix C
C.1
C.2
48/56
Block protection can be used to prevent any operation from modifying the data stored in the
Flash. Each Block can be protected individually. Once protected, Program and Erase
operations on the block fail to change the data.
There are three techniques that can be used to control Block Protection, these are the
Programmer technique, the In-System technique and Temporary Unprotection. Temporary
Unprotection is controlled by the Reset/Block Temporary Unprotection pin, RP; this is
described in the Signal Descriptions section.
Unlike the Command Interface of the Program/Erase Controller, the techniques for
protecting and unprotecting blocks change between different Flash memory suppliers. For
example, the techniques for AMD parts will not work on Numonyx parts. Care should be
taken when changing drivers for one part to work on another.
Programmer Technique
The Programmer technique uses high (V
cannot be achieved using a standard microprocessor bus, therefore the technique is
recommended only for use in Programming Equipment.
To protect a block follow the flowchart in
Flowchart. To unprotect the whole chip it is necessary to protect all of the blocks first, then
all blocks can be unprotected at the same time. To unprotect the chip follow
Programmer Equipment Chip Unprotect
Operations, BYTE = VIHor
The timing on these flowcharts is critical. Care should be taken to ensure that, where a
pause is specified, it is followed as closely as possible. Do not abort the procedure before
reaching the end. Chip Unprotect can take several seconds and a user message should be
provided to show that the operation is progressing.
In-System Technique
The In-System technique requires a high voltage level on the Reset/Blocks Temporary
Unprotect pin, RP. This can be achieved without violating the maximum ratings of the
components on the microprocessor bus, therefore this technique is suitable for use after the
Flash has been fitted to the system.
To protect a block follow the flowchart in
Flowchart. To unprotect the whole chip it is necessary to protect all of the blocks first, then
all the blocks can be unprotected at the same time. To unprotect the chip follow Figure
Figure 19: In-System Equipment Chip Unprotect
The timing on these flowcharts is critical. Care should be taken to ensure that, where a
pause is specified, it is followed as closely as possible. Do not allow the microprocessor to
service interrupts that will upset the timing and do not abort the procedure before reaching
the end. Chip Unprotect can take several seconds and a user message should be provided
to show that the operation is progressing.
Block Protection
VIL, gives a summary of each operation.
Flowchart.
Figure 16: Programmer Equipment Block Protect
Figure 18: In-System Equipment Block Protect
ID
) voltage levels on some of the bus pins. These
Flowchart.
Table 27: Programmer Technique Bus
Figure 17:

Related parts for M29W320DT70ZE6F