PCF8576CT/1,118 NXP Semiconductors, PCF8576CT/1,118 Datasheet - Page 50

• Manufacturer Part Number: PCF8576CT/1,118
• Description: IC LCD DVR UNVRSL LOW-MUX 56VSOP
• Manufacturer: NXP Semiconductors

Specifications of PCF8576CT/1,118

• Package / Case: 56-VSOP
• Display Type: LCD
• Configuration: 40 Segment
• Interface: I²C
• Current - Supply: 120µA
• Voltage - Supply: 2 V ~ 6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Number Of Digits: 20
• Number Of Segments: 160
• Maximum Clock Frequency: 315 KHz
• Operating Supply Voltage: 2 V to 6 V
• Maximum Power Dissipation: 400 mW
• Maximum Operating Temperature: + 150 C
• Maximum Supply Current: 120 uA
• Minimum Operating Temperature: - 65 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Digits Or Characters: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-1080-2; 935278818118; PCF8576CTD-T

NXP Semiconductors
PCF8576C
Product data sheet
17.3 Wave soldering
17.4 Reflow soldering
Key characteristics in both wave and reflow soldering are:
Key characteristics in wave soldering are:
Key characteristics in reflow soldering are:
Table 21.
Package thickness (mm)
< 2.5
≥ 2.5
•
•
•
•
•
•
•
•
•
•
•
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specifications, including temperature and impurities
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 21
SnPb eutectic process (from J-STD-020C)
and
All information provided in this document is subject to legal disclaimers.
22
Rev. 10 — 22 July 2010
Package reflow temperature (°C)
Volume (mm
< 350
235
220
3
)
Universal LCD driver for low multiplex rates
Figure
40) than a SnPb process, thus
≥ 350
220
220
PCF8576C
© NXP B.V. 2010. All rights reserved.
50 of 57