LTC4257IS8 Linear Technology, LTC4257IS8 Datasheet - Page 19

IC CONTROLLER POE INTERFAC 8SOIC

LTC4257IS8

Manufacturer Part Number
LTC4257IS8
Description
IC CONTROLLER POE INTERFAC 8SOIC
Manufacturer
Linear Technology
Type
Power over Ethernet Switch (PoE)r
Datasheet

Specifications of LTC4257IS8

Applications
IP Phones, Power over LAN, Network Routers and Switches
Internal Switch(s)
Yes
Current Limit
350mA
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
8-SOIC (0.154", 3.90mm Width)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LTC4257IS8
Manufacturer:
LT
Quantity:
10 000
Part Number:
LTC4257IS8
Manufacturer:
LINEAR/凌特
Quantity:
20 000
Part Number:
LTC4257IS8#TRPBF
Manufacturer:
FSC
Quantity:
6 218
Part Number:
LTC4257IS8-1
Manufacturer:
LT
Quantity:
10 000
Part Number:
LTC4257IS8-1#PBF
Manufacturer:
LINEAR/凌特
Quantity:
20 000
Part Number:
LTC4257IS8-1#TRPBF
Manufacturer:
LINEAR
Quantity:
7 556
PACKAGE DESCRIPTIO
.030 ±.005
3.5 ±0.05
NOTE:
1. DIMENSIONS IN
2. DRAWING NOT TO SCALE
TYP
.245
MIN
2.15 ±0.05
RECOMMENDED SOLDER PAD LAYOUT
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
.050 BSC
1.65 ±0.05
(2 SIDES)
0.25 ± 0.05
(MILLIMETERS)
INCHES
2.38 ±0.05
(2 SIDES)
.045 ±.005
3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
.160 ±.005
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm)
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
0.50
BSC
(5.791 – 6.197)
.228 – .244
U
0.675 ±0.05
8-Lead Plastic Small Outline (Narrow .150 Inch)
PACKAGE
OUTLINE
8-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1698)
(Reference LTC DWG # 05-08-1610)
1
8
TOP MARK
(NOTE 6)
(4.801 – 5.004)
.189 – .197
PIN 1
7
2
0.200 REF
DD Package
NOTE 3
S8 Package
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
ON TOP AND BOTTOM OF PACKAGE
6
3
5
4
(3.810 – 3.988)
.150 – .157
NOTE 3
3.00 ±0.10
0.75 ±0.05
(4 SIDES)
(0.203 – 0.254)
.008 – .010
(1.346 – 1.752)
(0.355 – 0.483)
0.00 – 0.05
.053 – .069
.014 – .019
TYP
1.65 ± 0.10
(0.254 – 0.508)
(2 SIDES)
.010 – .020
(0.406 – 1.270)
BOTTOM VIEW—EXPOSED PAD
.016 – .050
0.25 ± 0.05
R = 0.115
× 45°
TYP
4
5
2.38 ±0.10
(2 SIDES)
LTC4257
(1.270)
.050
BSC
0°– 8° TYP
8
1
0.50 BSC
(0.101 – 0.254)
.004 – .010
0.38 ± 0.10
19
(DD8) DFN 1203
4257fb
SO8 0303

Related parts for LTC4257IS8