VNS1NV04 STMicroelectronics, VNS1NV04 Datasheet - Page 17

MOSFET N-CH 40V 1.7A 8-SOIC

VNS1NV04

Manufacturer Part Number
VNS1NV04
Description
MOSFET N-CH 40V 1.7A 8-SOIC
Manufacturer
STMicroelectronics
Series
OMNIFET II™r
Type
Low Sider
Datasheet

Specifications of VNS1NV04

Input Type
Non-Inverting
Number Of Outputs
2
On-state Resistance
250 mOhm
Current - Peak Output
1.7A
Mounting Type
Surface Mount
Package / Case
8-SOIC (3.9mm Width)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Voltage - Supply
-
Operating Temperature
-
Current - Output / Channel
-
Other names
497-2672-5

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
VNS1NV04-E
Manufacturer:
ST
0
Part Number:
VNS1NV0413TR
Manufacturer:
PHILIPS
Quantity:
240
Part Number:
VNS1NV0413TR
Manufacturer:
ST
0
Part Number:
VNS1NV0413TR
Manufacturer:
ST
Quantity:
20 000
Part Number:
VNS1NV04D
Manufacturer:
STM
Quantity:
641
Part Number:
VNS1NV04D
Manufacturer:
ST
Quantity:
20 000
Part Number:
VNS1NV04D-13TR
Manufacturer:
ST
0
Part Number:
VNS1NV04D-E
Manufacturer:
ST
0
Part Number:
VNS1NV04D13TR
Manufacturer:
ST
Quantity:
8 000
Part Number:
VNS1NV04D13TR
Manufacturer:
ST
Quantity:
20 000
Part Number:
VNS1NV04DP
Manufacturer:
ST
Quantity:
20 000
Part Number:
VNS1NV04DP-E
Manufacturer:
ST
Quantity:
3 310
Part Number:
VNS1NV04DPTR
Manufacturer:
ST
Quantity:
20 000
Part Number:
VNS1NV04DPTR
0
Part Number:
VNS1NV04DPTR-E
Manufacturer:
ST
Quantity:
3 310
VND1NV04 - VNN1NV04 - VNS1NV04
4
4.1
Package and PCB thermal data
DPAK thermal data
Figure 30. DPAK PC board
1. Layout condition of R
Figure 31. DPAK R
Cu thickness=35 µm , Copper areas: from minimum pad layout to 16 cm
90
80
70
60
50
40
30
0
footprint
th
thj-amb
PCB Cu heat sink area ( cm^ 2) - ( refer t o PCB layout )
and Z
2
th
measurements (PCB FR4 area = 58 mm x 58 mm,PCB thickness = 2 mm,
vs. PCB copper area in open box free air condition
Doc ID 7381 Rev 2
4
6
Package and PCB thermal data
2
).
8
17/33
10

Related parts for VNS1NV04