L6235D013TR STMicroelectronics, L6235D013TR Datasheet - Page 19

• Manufacturer Part Number: L6235D013TR
• Description: IC DRIVER 3PHASE DC MOTOR 24SOIC
• Manufacturer: STMicroelectronics
• Type: Driverr

Specifications of L6235D013TR

• Applications: DC Motor Driver, Brushless (BLDC), 3 Phase
• Number Of Outputs: 1
• Current - Output: 5.6A
• Voltage - Supply: 12 V ~ 52 V
• Operating Temperature: -25°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 24-SOIC (7.5mm Width)
• Operating Current: 10mA
• Operating Temperature Classification: Automotive
• Package Type: SO
• Operating Supply Voltage (min): 12V
• Operating Supply Voltage (typ): 42V
• Operating Supply Voltage (max): 52V
• Operating Supply Voltage: 7 V to 52 V
• Supply Current: 0.006 A
• Mounting Style: SMD/SMT
• For Use With: 497-4935 - BOARD MOTOR BRUSHLESS DC L6235
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Voltage - Load: -
• Lead Free Status / Rohs Status: Compliant
• Other names: 497-4009-2

OUTPUT CURRENT CAPABILITY AND IC POWER DISSIPATION
In Figure 22 is shown the approximate relation between the output current and the IC power dissipation using
PWM current control.
For a given output current the power dissipated by the IC can be easily evaluated, in order to establish which
package should be used and how large must be the on-board copper dissipating area to guarantee a safe op-
erating junction temperature (125°C maximum).
Figure 22. IC Power Dissipation versus Output Power.
THERMAL MANAGEMENT
In most applications the power dissipation in the IC is the main factor that sets the maximum current that can
be delivered by the device in a safe operating condition. Selecting the appropriate package and heatsinking con-
figuration for the application is required to maintain the IC within the allowed operating temperature range for
the application. Figures 23, 24 and 25 show the Junction-to-Ambient Thermal Resistance values for the
PowerSO36, PowerDIP24 and SO24 packages.
For instance, using a PowerSO package with copper slug soldered on a 1.5mm copper thickness FR4 board
with 6cm
mounting methods for this package. Using a multi-layer board with vias to a ground plane, thermal impedance
can be reduced down to 15°C/W.
Figure 23. PowerSO36 Junction-Ambient thermal resistance versus on-board copper area.
2
dissipating footprint (copper thickness of 35 m), the R
ºC / W
43
38
33
28
23
18
13
P
D
[W]
1
2
10
8
6
4
2
0
3
0
4
0.5
5
6
s q . c m
1
7
I
W ith o ut G ro u nd La yer
W ith Gro un d La yer
W ith Gro un d La yer+ 16 via
H o le s
OUT
8
1.5
[A]
9
10
2
1 1
1 2
2.5
13
3
Test Condition s:
Supply Voltage = 24 V
I
I
I
1
2
3
th(j-amb)
On-Board Copper Area
No PWM
f
SW
I
OUT
= 30 kHz (slow decay)
is about 35°C/W. Figure 26 shows
I
OUT
I
OUT
L6235
19/25