FSCT07A-UH5 STMicroelectronics, FSCT07A-UH5 Datasheet - Page 8

• Manufacturer Part Number: FSCT07A-UH5
• Description: IC CONTROLLER FAN SPEED IPPAK
• Manufacturer: STMicroelectronics
• Type: 18 Line 3-5 Volt Low Capacitance SCSI Active Terminatorr

Specifications of FSCT07A-UH5

• Applications: Fan Controller
• Number Of Outputs: 1
• Voltage - Supply: 9 V ~ 15 V
• Operating Temperature: 0°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: IPPAK-5
• Product: Fan / Motor Controllers / Drivers
• Operating Supply Voltage: 7 V
• Supply Current: 3 mA
• Mounting Style: Through Hole
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Output: -
• Voltage - Load: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

FSCTxxA-UH5
Two components should be used to improve the heat exchange between the FSCT die and the heat sink,
that the temperature has to be monitored. These components are:
Several clips can be used depending on the heat sink type:
Fig. 9: IPPAK mounted with a Saddle clip.
It can be noticed that the thickness of the IPPAK package (2.3 +/- 0.1 mm) is similar to those of SOT-32 and
SOT-82 (2.55 +/- 0.15 mm). The same clips can so be used for all these packages.
3.3 Temperature measurement error
Firstly, the time constant between a temperature variation on the external side on the IPPAK copper tab,
and the silicon die is in the range of a few hundred of milliseconds. As temperature phenomena are ex-
tremely slow for the targeted applications (the temperature of a MOSFET heat sink, increases typically with
an 1°C per second rate, in a power supply), the FSCT is able to react immediately to over-heating events.
Moreover, the very low junction to case thermal resistance (3 °C/W) reduces as much as possible the tem-
perature measurement error.
We calculate, in the following, this error considering both the package and the heatsink-Tab interface ther-
mal resistances ( figure 11 ).
Several companies offer adhesive and isolating
materials to be used as interface between elec-
tronic devices and a heat sink. These interfaces
can be provided with a shape dedicated for the
Tab foot print. For the IPPAK package, users could
choose a shape dedicated for SOT-32, SOT-82 or
even TO-126 or TO-220 packages (the more can
do the less).
8/11
A thermal interface pad, in order to reduce the impact of air voids on the thermal impedance and to en-
sure an electrical insulation (if needed)
A clip to push the IPPAK against the heat sink and then to reduce also the interface thermal imped-
ance.
Saddle clips (cf. figure 9 ) for slim heat sink;
U-clips (cf. figure 10 ) for thick heat sink
Dedicated clips for special shape heat sink.
Fig. 10: IPPAK mounted with a U-clip.
Fig. 11: IPPAK Heatsink Interface.
Interface
Interface