TDA3681J/N2S,112 NXP Semiconductors, TDA3681J/N2S,112 Datasheet - Page 27

• Manufacturer Part Number: TDA3681J/N2S,112
• Description: IC REG MULTIPLE VOLTAGE SOT243
• Manufacturer: NXP Semiconductors

Specifications of TDA3681J/N2S,112

• Package / Case: *
• Applications: Ignition Buffer, Regulator
• Current - Supply: 110µA
• Voltage - Supply: 9.5 V ~ 18 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Through Hole
• Number Of Outputs: 4
• Polarity: Positive
• Output Voltage: 8.5 V, 5 V, 3.3 V
• Output Type: Fixed
• Dropout Voltage (max): 0.7 V at 550 mA or 0.6 V at 100 mA
• Line Regulation: 75 mV
• Load Regulation: 150 mV
• Maximum Power Dissipation: 62 W
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 935289137112

Philips Semiconductors
Suitability of IC packages for wave, reflow and dipping soldering methods
Notes
1. For more detailed information on the BGA packages refer to the “(LF)BGA Application Note ” (AN01026); order a copy
2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
3. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
4. Hot bar soldering or manual soldering is suitable for PMFP packages.
5. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account
6. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
7. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction.
8. Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
9. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than
10. Hot bar or manual soldering is suitable for PMFP packages.
11. Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted
2004 Mar 31
Through-hole mount CPGA, HCPGA
Through-hole-
surface mount
Surface mount
Multiple voltage regulator with switch and
ignition buffer
from your Philips Semiconductors sales office.
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods” .
be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature
exceeding 217 C
must be kept as low as possible.
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
The package footprint must incorporate solder thieves downstream and at the side corners.
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar
soldering process. The appropriate soldering profile can be provided on request.
MOUNTING
DBS, DIP, HDIP, RDBS, SDIP, SIL
PMFP
BGA, HTSSON..T
SSOP-T
DHVQFN, HBCC, HBGA, HLQFP, HSO,
HSOP, HSQFP, HSSON, HTQFP, HTSSOP,
HVQFN, HVSON, SMS
PLCC
LQFP, QFP, TQFP
SSOP, TSSOP, VSO, VSSOP
CWQCCN..L
10 C measured in the atmosphere of the reflow oven. The package body peak temperature
(7)
(4)
, SO, SOJ
(5)
, TFBGA, USON, VFBGA
(11)
, PMFP
PACKAGE
(5)
, LBGA, LFBGA, SQFP,
(10)
, WQCCN32L
(1)
27
(11)
suitable
suitable
not suitable
not suitable
not suitable
suitable
not recommended
not recommended
not suitable
(3)
WAVE
(6)
SOLDERING METHOD
(7)(8)
(9)
not suitable
suitable
suitable
suitable
suitable
suitable
not suitable
REFLOW
Product specification
TDA3681
(2)
DIPPING
suitable