MC33912BACR2 Freescale Semiconductor, MC33912BACR2 Datasheet - Page 8

• Manufacturer Part Number: MC33912BACR2
• Description: IC SYSTEM BASIS CHIP 32LQFP
• Manufacturer: Freescale Semiconductor

Specifications of MC33912BACR2

• Applications: System Basis Chip
• Current - Supply: 4.5mA
• Voltage - Supply: 5.5 V ~ 27 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 32-LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Table 3. Maximum Ratings (continued)
permanent damage to the device.
8
33912
THERMAL RATINGS
Notes
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ESD Capability
Operating Ambient Temperature
Operating Junction Temperature
Storage Temperature
Thermal Resistance, Junction to Ambient
Natural Convection, Single Layer board (1s)
Natural Convection, Four Layer board (2s2p)
Thermal Resistance, Junction to Case
Peak Package Reflow Temperature During Reflow
10.
11.
12.
13.
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
8.
9.
AECQ100
According to LIN Conformance Test Specification / LIN EMC Test
Specification, August 2004 (C
According to IEC 61000-4-2 (C
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient
temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
Per JEDEC JESD51-2 with the single layer board (JESD51-3) horizontal.
Per JEDEC JESD51-6 with the board (JESD51-7) horizontal.
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method 1012.1).
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL), go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and
enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.
Charge Device Model - JESD22/C101 (C
Unpowered
Human Body Model - JESD22/A114 (C
Contact Discharge, Unpowered
all other Pins
LIN Pin
L1, L2, L3, and L4
Corner Pins (Pins 1, 8, 9, 16, 17, 24, 25 and 32)
LIN pin with 220 pF and without capacitor
VS1/VS2 (100 nF to ground)
Lx inputs (33 kΩ serial resistor)
LIN pin with 220 pF
LIN pin without capacitor
VS1/VS2 (100 nF to ground)
Lx inputs (33 kΩ serial resistor)
All other Pins (Pins 2-7, 10-15, 18-23, 26-31)
ZAP
(8)
ZAP
Ratings
= 150 pF, R
(11)
= 150 pF, R
(8), (9)
(8), (10)
ZAP
ZAP
ZAP
ZAP
(12), (13)
= 100 pF, R
= 4.0 pF)
= 330 Ω)
= 330 Ω)
ZAP
= 1500 Ω)
33912
34912
Symbol
V
V
V
V
V
V
V
V
V
V
V
V
T
ESD1-1
ESD1-2
ESD1-3
ESD2-1
ESD2-2
ESD3-1
ESD3-2
ESD3-3
ESD3-4
ESD4-1
ESD4-2
ESD4-3
T
R
R
PPRT
T
T
STG
θJC
θJA
A
J
Analog Integrated Circuit Device Data
-40 to 125
-40 to 150
-55 to 150
-40 to 85
Note 13
± 8000
± 8000
± 8000
±2000
>± 12k
±6000
Value
± 8.0k
± 6.0k
± 750
± 500
± 20k
± 11k
85
56
23
Freescale Semiconductor
°C/W
°C/W
Unit
°C
°C
°C
°C
V