PIP250M,518 NXP Semiconductors, PIP250M,518 Datasheet

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PIP250M,518

Manufacturer Part Number
PIP250M,518
Description
IC CONV DC/DC BUCK 68-HVQFN
Manufacturer
NXP Semiconductors
Type
Step-Down (Buck)r
Datasheet

Specifications of PIP250M,518

Internal Switch(s)
Yes
Synchronous Rectifier
Yes
Number Of Outputs
1
Voltage - Output
Adj to 0.8V
Current - Output
15A
Frequency - Switching
300kHz
Voltage - Input
5V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
68-VQFN Exposed Pad, 68-HVQFN, 68-SQFN, 68-DHVQFN
Power - Output
3.6W
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
568-2329-2
934057515518
PIP250M /T3
1. Description
2. Features
3. Applications
4. Ordering information
Table 1:
Type number
PIP250M
Ordering information
Package
Name
HVQFN68
M3D797
The PIP250M is a fully integrated synchronous buck converter intended for use as a
point-of-load regulator. It contains two N-channel power MOSFETs, a Schottky diode
and a voltage mode, pulse width modulated (PWM) controller. The controller features
include overcurrent and overvoltage protection and undervoltage lockout functions.
By combining the power components and the controller into a single component,
stray inductances are virtually eliminated, resulting in lower switching losses and a
compact, efficient design with minimal external component count.
PIP250M
Integrated buck converter
Rev. 02 — 21 February 2003
Output current up to 15 A
Single supply 5 V operation
Fixed 300 kHz operating frequency
Voltage mode control
Minimum regulated output voltage 0.8 V
Internal soft start
Overcurrent protection
Overvoltage protection
Remote sensing.
High-current point-of-load regulation
Distributed power architectures
Multiple output telecom power supplies
Microprocessor and Digital Signal Processing (DSP) supplies
Computer peripheral supplies
Cable modems
Set-top boxes.
Description
plastic, thermal enhanced very thin quad flat package; no leads;
68 terminals; body 10
10
0.85 mm
Version
SOT687-1
Product data

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PIP250M,518 Summary of contents

Page 1

PIP250M Integrated buck converter Rev. 02 — 21 February 2003 M3D797 1. Description The PIP250M is a fully integrated synchronous buck converter intended for use as a point-of-load regulator. It contains two N-channel power MOSFETs, a Schottky diode and a ...

Page 2

Philips Semiconductors 5. Block diagram 61 DDC PIP250M 0.8 V REFERENCE 0 ERROR 8, 60, 67 AMP 68, PAD1 V SSC Fig 1. Block diagram 9397 750 10904 Product data 6.0 V REGULATOR ...

Page 3

Philips Semiconductors 6. Pinning information 6.1 Pinning Grey area denotes terminal 1 index area. Fig 2. Pin configuration (footprint view). 6.2 Pin description Table 2: Symbol V DDO V SSO V DDC V SSC VO CB PHASE OCSET/ ENABLE FB ...

Page 4

Philips Semiconductors [1] PAD1, PAD2 and PAD3 are electrical connections and must be soldered to the printed circuit board [2] All n.c. pins should be connected Functional description 7.1 Pin functions 7.1.1 Output stage supply (V The ...

Page 5

Philips Semiconductors 7.2 Operation 7.2.1 Single supply operation Fig 3. Single supply operation. Operation of the PIP250M from a single 5 V conversion supply is shown in The upper MOSFET gate driver stage is supplied from the CB pin. An ...

Page 6

Philips Semiconductors 7.2.5 Overcurrent protection Fig 4. Overcurrent protection. The overcurrent protection function is shown in is enabled when the upper MOSFET gate drive signal is HIGH. During this interval, the voltage on the PHASE input is compared with the ...

Page 7

Philips Semiconductors Fig 5. Overcurrent trip level as a function of R 7.2.6 Undervoltage and overvoltage protection With reference to undervoltage comparators, labelled OVP and UVP respectively. In normal operation, the voltage regulated at 0 ...

Page 8

Philips Semiconductors 8. Limiting values Table 3: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V control circuit supply voltage DDC V output stage supply voltage DDO V input voltage on PHASE PHASE V ...

Page 9

Philips Semiconductors 9. Thermal characteristics Table 4: Thermal characteristics Symbol Parameter R thermal resistance from th(j-pcb) junction to printed-circuit board R thermal resistance from th(j-a) junction to ambient R thermal resistance from th(j-c) junction to case 10. Characteristics Table 5: ...

Page 10

Philips Semiconductors Table 5: Characteristics …continued circuit of Figure 9 DDC amb Symbol Parameter Error amplifier G open loop gain ol GB Gain bandwidth product Overvoltage, overcurrent and undervoltage protection V overvoltage ...

Page 11

Philips Semiconductors 11. Application information conversion 1.2 H supply ( shut down BSH112 Fig 9. Typical application circuit. 9397 750 10904 Product data BAW62 V DDC V DDO CB 2000 2 PIP250M OCSET/ VO ...

Page 12

Philips Semiconductors 12. Marking terminal 1 index area TYPE No. DIFFUSION LOT No. MANUFACTURING CODE COUNTRY OF ORIGIN TYPE No: PIP250M-NN (NN is version number) DIFFUSION LOT No: 7 characters MANUFACTURING CODE: see Figure 11 COUNTRY OF ORIGIN: Korea Fig ...

Page 13

Philips Semiconductors 13. Package outline HVQFN68: plastic thermal enhanced very thin quad flat package; no leads; 68 terminals; body 0.85 mm terminal 1 index area terminal 1 68 ...

Page 14

Philips Semiconductors 14. Soldering 14.1 Introduction to soldering HVQFN packages The HVQFN package is a near Chip Scale Package (CSP) with a copper lead frame leadless package, where electrical contact to the printed circuit board is made ...

Page 15

Philips Semiconductors 14.2 Rework guidelines Since the solder joints are largely inaccessible, only the side fillets can be touched up. If there are defects underneath the package, then the whole package has to be removed. The first step in component ...

Page 16

Philips Semiconductors 7.6 Cu 11.15 OA 0 0.5 Fig 15. PCB footprint for SOT687-1 package (reflow soldering). 15.2 Solder paste printing The process of ...

Page 17

Philips Semiconductors 16. Revision history Table 6: Revision history Rev Date CPCN Description 02 20030221 - Product data (9397 750 10904) Modifications: • Table • Section – Dual supply operation deleted – Regulated output voltage section added – Overcurrent protection ...

Page 18

Philips Semiconductors Philips Semiconductors 17. Data sheet status [1] Level Data sheet status Product status I Objective data Development II Preliminary data Qualification III Product data Production [1] Please consult the most recently issued data sheet before initiating or completing ...

Page 19

Philips Semiconductors Contents 1 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . ...

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