TDA8350Q/N6,112 NXP Semiconductors, TDA8350Q/N6,112 Datasheet - Page 11

• Manufacturer Part Number: TDA8350Q/N6,112
• Description: IC DC COUPLED V-DEFL 13-SIL
• Manufacturer: NXP Semiconductors

Specifications of TDA8350Q/N6,112

• Applications: *
• Mounting Type: Through Hole
• Package / Case: 13-SIL (Bent and Staggered Leads)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 935262194112; TDA8350QU; TDA8350QU

Philips Semiconductors
PACKAGE OUTLINE
1999 Sep 27
DBS13P: plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm)
DC-coupled vertical deflection and
East-West output circuit
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
VERSION
OUTLINE
SOT141-6
17.0
15.5
A
1
Z
A
4.6
4.2
2
0.75
0.60
b
p
e
0.48
0.38
IEC
c
e
D
d
1
24.0
23.6
D
(1)
20.0
19.6
d
b
p
JEDEC
D
10
h
w
12.2
11.8
REFERENCES
M
E
13
(1)
0
3.4
j
e
e
1.7
scale
1
EIAJ
11
5
5.08
e
2
non-concave
E h
10 mm
E
6
h
L
B
x
L
3.4
3.1
3
j
Q
12.4
11.0
m
L
A
view B: mounting base side
2
2.4
1.6
L
3
e
c
2
PROJECTION
4.3
EUROPEAN
m
D
h
E
2.1
1.8
Q
A
v
0.8
Product specification
M
v
TDA8350Q
0.25
w
ISSUE DATE
95-03-11
97-12-16
0.03
x
SOT141-6
2.00
1.45
Z
(1)