HCPL-0701-000E Avago Technologies US Inc., HCPL-0701-000E Datasheet - Page 2

OPTOCOUPLR DARL-OUT 100KBD 8SOIC

HCPL-0701-000E

Manufacturer Part Number
HCPL-0701-000E
Description
OPTOCOUPLR DARL-OUT 100KBD 8SOIC
Manufacturer
Avago Technologies US Inc.
Type
Logicr
Datasheets

Specifications of HCPL-0701-000E

Input Type
DC
Package / Case
8-SOIC (0.154", 3.90mm Width)
Voltage - Isolation
3750Vrms
Number Of Channels
1, Unidirectional
Current - Output / Channel
60mA
Data Rate
100KBd
Propagation Delay High - Low @ If
5µs @ 500µA
Current - Dc Forward (if)
20mA
Output Type
Open Collector
Mounting Type
Surface Mount
Isolation Voltage
3750 Vrms
Maximum Continuous Output Current
60 mA
Maximum Forward Diode Current
20 mA
Minimum Forward Diode Voltage
1.25 V
Output Device
Darlington With Base
Configuration
1 Channel
Current Transfer Ratio
5000 %
Maximum Baud Rate
100 KBps
Maximum Forward Diode Voltage
1.7 V
Maximum Reverse Diode Voltage
5 V
Maximum Input Diode Current
20 mA
Maximum Power Dissipation
135 mW
Maximum Operating Temperature
+ 70 C
Minimum Operating Temperature
0 C
Number Of Elements
1
Reverse Breakdown Voltage
5V
Forward Voltage
1.7V
Forward Current
20mA
Package Type
SOIC
Collector Current (dc) (max)
60mA
Power Dissipation
135mW
Pin Count
8
Mounting
Surface Mount
Operating Temp Range
0C to 70C
Operating Temperature Classification
Commercial
No. Of Channels
1
Optocoupler Output Type
Photodarlington
Input Current
12mA
Output Voltage
18V
Opto Case Style
SOIC
No. Of Pins
8
Ctr Max
5000%
Ctr Min
400%
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
516-1637-5

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HCPL-0701-000E
Manufacturer:
AVAGO
Quantity:
40 000
Part Number:
HCPL-0701-000E
Manufacturer:
AVAGO
Quantity:
20 000
Company:
Part Number:
HCPL-0701-000E
Quantity:
315
Selection for lower input current down to 250 µA is
available upon request.
The HCPL-0701 and HCPL-0700 are surface mount devices
packaged in an industry standard SOIC-8 footprint.
The SOIC-8 does not require “through holes” in a PCB.
This package occupies approximately one-third the
footprint area of the standard dual-in-line package. The
Selection Guide
Note:
1. Technical data are on separate Avago publications.
2
HCPL-4701
Channel
Package
6N139
6N138
Single
8-Pin DIP
(300 Mil)
[1]
Package
Channel
2731
2730
4731
HCPL-
Dual
[1]
[1]
[1]
Package
Channel
Small Outline SO-8
070A
Single
HCPL-
0701
0700
[1]
Channel
Package
073A
HCPL-
0731
0730
Dual
[1]
HCNW139
HCNW138
Widebody
(400 mil)
Package
Channel
Package
Single
lead profile is designed to be compatible with standard
surface mount processes.
The HCNW139 and HCNW138 are packaged in a
widebody encapsulation that provides creep age and
clearance dimensions suitable for safety approval by
regulatory agencies worldwide.
Minimum
Input ON
Current
0.5 mA
1.6 mA
0.5 mA
40 µA
(I
F
)
Minimum
400%
300%
800%
300%
CTR
Absolute
Maxi-
mum
18 V
18 V
20 V
7 V
V
CC
Single and
Hermetic
Packages
Channel
5701
5700
5731
5730
HCPL-
Dual
[1]
[1]
[1]
[1]

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