HCPL-0701-000E Avago Technologies US Inc., HCPL-0701-000E Datasheet - Page 6

• Manufacturer Part Number: HCPL-0701-000E
• Description: OPTOCOUPLR DARL-OUT 100KBD 8SOIC
• Manufacturer: Avago Technologies US Inc.
• Type: Logicr

Specifications of HCPL-0701-000E

• Input Type: DC
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Voltage - Isolation: 3750Vrms
• Number Of Channels: 1, Unidirectional
• Current - Output / Channel: 60mA
• Data Rate: 100KBd
• Propagation Delay High - Low @ If: 5µs @ 500µA
• Current - Dc Forward (if): 20mA
• Output Type: Open Collector
• Mounting Type: Surface Mount
• Isolation Voltage: 3750 Vrms
• Maximum Continuous Output Current: 60 mA
• Maximum Forward Diode Current: 20 mA
• Minimum Forward Diode Voltage: 1.25 V
• Output Device: Darlington With Base
• Configuration: 1 Channel
• Current Transfer Ratio: 5000 %
• Maximum Baud Rate: 100 KBps
• Maximum Forward Diode Voltage: 1.7 V
• Maximum Reverse Diode Voltage: 5 V
• Maximum Input Diode Current: 20 mA
• Maximum Power Dissipation: 135 mW
• Maximum Operating Temperature: + 70 C
• Minimum Operating Temperature: 0 C
• Number Of Elements: 1
• Reverse Breakdown Voltage: 5V
• Forward Voltage: 1.7V
• Forward Current: 20mA
• Package Type: SOIC
• Collector Current (dc) (max): 60mA
• Power Dissipation: 135mW
• Pin Count: 8
• Mounting: Surface Mount
• Operating Temp Range: 0C to 70C
• Operating Temperature Classification: Commercial
• No. Of Channels: 1
• Optocoupler Output Type: Photodarlington
• Input Current: 12mA
• Output Voltage: 18V
• Opto Case Style: SOIC
• No. Of Pins: 8
• Ctr Max: 5000%
• Ctr Min: 400%
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 516-1637-5

Solder Reflow Temperature Profile
6
8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300 (HCNW139/HCNW138)
TEMPERATURE
ROOM
(0.071 ± 0.006)
1.80 ± 0.15
300
200
100
0
0
NOTE: NON-HALIDE FLUX SHOULD BE USED.
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
PREHEATING RATE 3 °C + 1 °C/–0.5 °C/SEC.
REFLOW HEATING RATE 2.5 °C ± 0.5 °C/SEC.
160 °C
150 °C
140 °C
8
1
(0.442 ± 0.006)
11.23 ± 0.15
7
2
(0.100)
3
6
BSC
2.54
50
3 °C + 1 °C/–0.5 °C
4
5
(0.061)
MAX.
1.55
150 °C, 90 + 30 SEC.
PREHEATING TIME
(0.354 ± 0.006)
(0.158)
9.00 ± 0.15
4.00
MAX.
(0.030 ± 0.010)
2.5 C ± 0.5 °C/SEC.
0.75 ± 0.25
100
TIME (SECONDS)
LAND PATTERN RECOMMENDATION
245 °C
TEMP.
PEAK
(0.051)
1.3
(0.039 ± 0.006)
(0.484 ± 0.012)
1.00 ± 0.15
12.30 ± 0.30
(0.433)
150
11.00
MAX.
SEC.
30
SEC.
30
(0.09)
2.29
50 SEC.
7° NOM.
SOLDERING
200 °C
TIME
200
(0.534)
13.56
(0.010
0.254
PEAK
TEMP.
240 °C
- 0.0051
+ 0.003)
+ 0.076
- 0.002)
TIGHT
TYPICAL
LOOSE
230 °C
TEMP.
PEAK
250