MT9LSDT3272Y-133D2 Micron Technology Inc, MT9LSDT3272Y-133D2 Datasheet - Page 11

• Manufacturer Part Number: MT9LSDT3272Y-133D2
• Description: MODULE SDRAM 256MB 168-DIMM
• Manufacturer: Micron Technology Inc

Specifications of MT9LSDT3272Y-133D2

• Memory Type: SDRAM
• Memory Size: 256MB
• Speed: 133MHz
• Package / Case: 168-DIMM
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 557-1299; MT9LSDT3272Y-133D2

Register and PLL Specifications
Table 11:
Table 12:
PDF: 09005aef80a2e32f/Source: 09005aef80a2e30d
SD9C16_32x72.fm - Rev. D 1/08 EN
Parameter
Parameter
Maximum clock pulse frequency
Propagation delay, single rank
(CK to output)
Propagation delay, dual rank
(CK to output)
Pulse duration
Setup time
Hold time
Operating clock frequency
Input duty cycle
Cycle-to-cycle jitter
Static phase offset
SSC induced skew
Output-to-output skew
Register Timing Requirements and Switching Characteristics
162835A device or equivalent JESD82-2
PLL Clock Driver Timing Requirements and Switching Characteristics
CDC2510 device or equivalent JESD82-5
Notes:
1. SSC = spread spectrum clock. The use of SSC synthesizers on the system motherboard will
2. Skew is defined as the total clock skew between any two outputs and, therefore, is speci-
reduce EMI.
fied as a maximum only.
Symbol
f
t
t
MAX
PD1
PD2
t
t
t
SU
W
H
Symbol
t
t
t
t
JIT
f
SSC
SK
t
DC
CK
∅
CC
O
128MB, 256MB (x72, ECC, SR): 168-Pin SDRAM RDIMM
50pF to GND and 50Ω to
30pF to GND and 50Ω to
Data before CK HIGH
Data after CK HIGH
CK, HIGH or LOW
Condition
–150
Min
–75
11
V
V
50
44
–
–
–
TT
TT
Micron Technology, Inc., reserves the right to change products or specifications without notice.
Max
140
150
150
150
55
75
Register and PLL Specifications
Min
150
1.4
0.7
3.3
1.0
0.6
Units
MHz
©2003 Micron Technology, Inc. All rights reserved
%
ps
ps
ps
ps
Max
240
3.5
2.5
–
–
–
Notes
Units
1, 2
MHz
ns
ns
ns
ns
ns