bgw211 NXP Semiconductors, bgw211 Datasheet
bgw211
Manufacturer Part Number
bgw211
Description
Power Wlan
Manufacturer
NXP Semiconductors
Datasheet
1.BGW211.pdf
(4 pages)
BGW211 Low-power
WLAN SiP
Optimized for use in battery-powered handheld devices,
the BGW211 System-in-a-Package (SiP) delivers complete
802.11g functionality with the industry’s lowest standby and
operating power consumption. It requires no external com-
ponents and uses only 150 mm
802.11g solution.
Key features
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•
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Advanced, single-package WLAN 802.11g optimized for mobile
handheld devices
Lowest-power consumption in standby (< 2 mW) and operating
modes (PA, RF, baseband/MAC)
Ultra-small form factor
Ideal mobile architecture
Comprehensive QoS
Co-exists with Bluetooth
Seamless upgrade path from BGW200 802.11b SiP
Complete software drivers, utilities, and diagnostic tools
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No RF-critical design required
Low total cost of ownership
Low-profile 68-pin HVQFN-like SiP package (10 x 15 x 1.3 mm)
No external components required
No WLAN related processor load in all operating modes
Integrated ARM7 controller with associated memories
All mandatory 802.11e features, plus DLS, Block ACK, APSD
Optimized for real-time applications with minimal system power
consumption
®
2
of board area for the total
Complete, single-package 802.11g
solution for mobile phones and
portable consumer devices
The BGW211 is Philips’ third-generation System-in-a-Package (SiP)
solution for low-power 802.11 Wireless LAN (WLAN). Supporting
complete 802.11g functionality, it enables consumers to access data and
multimedia content through WLAN networks up to five times faster
than current 802.11b products without compromising battery life.
The BGW211 delivers industry-leading standby and operating power in a
package that measures only 150 mm
nents for operation. Extensive support for Quality of Service (QoS) and
coexistence with Bluetooth wireless make it robust enough for very
demanding portable applications.
The latest SiP technology from Philips allows all of the components
needed for a complete 802.11g WLAN subsystem to be contained in
a single, low-profile HVQFN package that measures only 10 x 15 x 1.3
mm. The SiP contains the industry’s first 90-nm CMOS 802.11g base-
band/MAC and a silicon-germanium BiCMOS radio transceiver. Unlike
other “one-chip” solutions, which require the use of external receive
LNAs, transmit power amplifiers, and/or additional components, the
BGW211 SiP requires no external components to meet the range and
throughput performance requirements of mobile handsets and network
operators.
By providing complete system functionality in a single package, the SiP
format delivers quicker design cycles, reduces risk, simplifies manufac-
turing, and reduces the bill of materials. Also, because the SiP offers
fully tested functionality, it lets the customer’s development team focus
their energy on innovative product design instead of the complex issues
related to RF layout.
S e m i c o n d u c t o r s
2
and requires no external compo-
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bgw211 Summary of contents
Page 1
... BiCMOS radio transceiver. Unlike other “one-chip” solutions, which require the use of external receive LNAs, transmit power amplifiers, and/or additional components, the BGW211 SiP requires no external components to meet the range and throughput performance requirements of mobile handsets and network operators. ...
Page 2
... Other handhelds and electronic devices for wireless digital, audio, multimedia, and telephony Industry’s lowest power consumption The BGW211 builds on an established position as the industry’s lowest standby power mobile Wi-Fi solution to significantly reduce receive and transmit power during operation. It consumes 30% � ...
Page 3
... Philips BGB20x family of Bluetooth SiPs coexists seamlessly with the BGW211. Easy BGW200 upgrade path The new Philips BGW211 low-power 802.11g SiP is pin- and soft- ware-compatible with second-generation Philips BGW200 low- power 802.11b SiP, thereby facilitating an easy migration path for existing customers to design in the higher speed capability in future phones and handheld devices without board-level layout changes ...
Page 4
... BGW211 Low-power WLAN SiP Complete, single-package 802.11g solution for mobile phones & portable consumer devices BGW211 specifications Frequency bands 2.4 to 2.5 GHz Modulations DBPSK, DQPSK, CCK (DSSS), OFDM Data rates 1, 2, 5.5, 11 Mbps 6, 9, 12, 18, 24, 36, 48, 54 Mbps Receive power 300 mW (802.11b) 400 mW (802.11g) Transmit power (15 dBm) 550 mW (802 ...