EL5323 INTERSIL [Intersil Corporation], EL5323 Datasheet
EL5323
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EL5323 Summary of contents
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... The 8-Channel EL5223 is available in both the 20 Ld TSSOP and 24 Ld QFN packages, the 10-Channel EL5323 in the 24 Ld TSSOP and 24 Ld QFN packages, and the 12-Channel EL5423 in the 28 Ld TSSOP and 32 Ld QFN packages. All buffers are specified for operation over the full -40° ...
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... TOP VIEW VIN3 1 VIN4 2 VIN5 3 VIN6 4 THERMAL VS+ 5 PAD** VIN7 6 VIN8 7 VIN9 8 VIN10 9 * *THERMAL PAD CONNECTS TO VS- 2 EL5123, EL5223, EL5323, EL5423 EL5123 (10 LD MSOP) TOP VIEW VIN1 1 VIN2 2 VOUT3 VS+ 3 VOUT4 4 VIN3 VOUT5 VIN4 5 VS- VOUT6 VOUT7 VOUT8 EL5423 (28 LD TSSOP) ...
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... EL5423CL-T13* 5423CL EL5423CLZ (Note) 5423CLZ EL5423CLZ-T7* (Note) 5423CLZ EL5423CLZ-T13* (Note) 5423CLZ 3 EL5123, EL5223, EL5323, EL5423 PART MARKING 10 Ld MSOP (3.0mm MSOP (3.0mm MSOP (3.0mm MSOP (3.0mm) (Pb-free MSOP (3.0mm) (Pb-free MSOP (3.0mm) (Pb-free QFN (4mmx5mm) ...
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... RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 4 EL5123, EL5223, EL5323, EL5423 PART MARKING 28 Ld TSSOP (4.4mm TSSOP (4.4mm TSSOP (4 ...
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... Slew Rate (Note 3) t Settling to +0. + -3dB Bandwidth CS Channel Separation 5 EL5123, EL5223, EL5323, EL5423 Thermal Information = +25°C) Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C - -0.5V, V +0.5V Operating Temperature . . . . . . . . . . . . . . . . . . . . . . .-40°C to +85° Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Curves Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . .see link below http://www.intersil.com/pbfree/Pb-FreeReflow.asp ...
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... Input Impedance IN C Input Capacitance IN A Voltage Gain V OUTPUT CHARACTERISTICS V Output Swing Low OL V Output Swing High OH I (max) Output Current (Note 2) OUT 6 EL5123, EL5223, EL5323, EL5423 - = 0V 10kΩ and C = 10pF to 2.5V CONDITION V = 2.5V CM (Note 2.5V CM 0.5V ≤ V ≤ 4.5V OUT I = -2.5mA ...
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... Supply Current S DYNAMIC PERFORMANCE SR Slew Rate (Note 3) t Settling to +0. + -3dB Bandwidth CS Channel Separation 7 EL5123, EL5223, EL5323, EL5423 - = 0V 10kΩ and C = 10pF to 7.5V CONDITION V is moved from 4.5V to 15. load (EL5123) No load (EL5223) No load (EL5323) No load (EL5423) 1V ≤ V ≤ ...
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... S 1000pF R = 10kΩ 47pF -10 -20 -30 100k 1M FREQUENCY (Hz) FIGURE 5. FREQUENCY RESPONSE FOR VARIOUS C 8 EL5123, EL5223, EL5323, EL5423 1M 10M FIGURE 2. TOTAL HARMONIC DISTORTION + NOISE vs 1k 100pF 12pF 10M 100M FIGURE 6. FREQUENCY RESPONSE FOR VARIOUS R L 0.018 V = ± 10kΩ ...
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... FIGURE 9. INPUT NOISE SPECTRAL DENSITY vs FREQUENCY 2 ±5V S 1.5 0.5 -0.5 -1.5 -2.5 -35 - TEMPERATURE (°C) FIGURE 11. INPUT BIAS CURRENT vs TEMPERATURE 9 EL5123, EL5223, EL5323, EL5423 (Continued) 1M 10M FIGURE 8. OUTPUT IMPEDANCE vs FREQUENCY 10M 100M FIGURE 10. INPUT OFFSET VOLTAGE DISTRIBUTION FIGURE 12. OUTPUT HIGH VOLTAGE vs TEMPERATURE 600 V = ± +25° ...
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... FIGURE 15. VOLTAGE GAIN vs TEMPERATURE 0. +25°C A 0.69 0.67 0.65 0. SUPPLY VOLTAGE (V) FIGURE 17. SUPPLY CURRENT PER CHANNEL vs SUPPLY VOLTAGE 10 EL5123, EL5223, EL5323, EL5423 (Continued FIGURE 14. OUTPUT LOW VOLTAGE vs TEMPERATURE FIGURE 16. SUPPLY CURRENT PER CHANNEL vs 50mV/DIV FIGURE 18. SMALL SIGNAL TRANSIENT RESPONSE -4.934 V = ±5V ...
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... AMBIENT TEMPERATURE (°C) FIGURE 21. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE FIGURE 23. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE 11 EL5123, EL5223, EL5323, EL5423 (Continued) FIGURE 20. PACKAGE POWER DISSIPATION vs AMBIENT 100 125 150 FIGURE 22. PACKAGE POWER DISSIPATION vs AMBIENT JEDEC JESD51-3 LOW EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD ...
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... FIGURE 25. OPERATION WITH BEYOND-THE-RAILS INPUT Power Dissipation With the high-output drive capability of the EL5123, EL5223, EL5323, and EL5423 buffer possible to exceed the sinusoid. +125°C “absolute-maximum junction temperature” under P-P . certain load current conditions. Therefore important to ...
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... It is recommended that any unused buffer have the input tied to the ground plane. Driving Capacitive Loads The EL5123, EL5223, EL5323, and EL5423 can drive a wide range of capacitive loads. As load capacitance increases, however, the -3dB bandwidth of the device will decrease and the peaking increase. The buffers drive 10pF loads in parallel with 10kΩ ...
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... Mini SO Package Family (MSOP) 0. SEATING PLANE b 0. LEADS L1 c SEE DETAIL "X" DETAIL X 14 EL5123, EL5223, EL5323, EL5423 MDP0043 A MINI SO PACKAGE FAMILY (N/2)+1 SYMBOL A A1 PIN # (N/ 0. NOTES: 1 ...
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... SEATING PLANE 0.08 C SEE DETAIL "X" N LEADS & EXPOSED PAD SIDE VIEW ( ( LEADS DETAIL X 15 EL5123, EL5223, EL5323, EL5423 MDP0046 QFN (QUAD FLAT NO-LEAD) PACKAGE FAMILY (COMPLIANT TO JEDEC MO-220) B SYMBOL 0.075 ...
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... Minimum space between protru- sion and adjacent lead is 0.07mm (0.0027 inch). 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. (Angles in degrees) 16 EL5123, EL5223, EL5323, EL5423 M20.173 LEAD THIN SHRINK SMALL OUTLINE PLASTIC ...
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... However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 17 EL5123, EL5223, EL5323, EL5423 MDP0044 A THIN SHRINK SMALL OUTLINE PACKAGE FAMILY SYMBOL PIN #1 I ...