IRF6646 International Rectifier, IRF6646 Datasheet

MOSFET N-CH 80V 12A DIRECTFET

IRF6646

Manufacturer Part Number
IRF6646
Description
MOSFET N-CH 80V 12A DIRECTFET
Manufacturer
International Rectifier
Series
HEXFET®r
Datasheet

Specifications of IRF6646

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Standard
Rds On (max) @ Id, Vgs
9.5 mOhm @ 12A, 10V
Drain To Source Voltage (vdss)
80V
Current - Continuous Drain (id) @ 25° C
12A
Vgs(th) (max) @ Id
4.9V @ 150µA
Gate Charge (qg) @ Vgs
50nC @ 10V
Input Capacitance (ciss) @ Vds
2060pF @ 25V
Power - Max
2.8W
Mounting Type
Surface Mount
Package / Case
DirectFET™ Isometric MN
Configuration
Single Quad Drain Dual Source
Transistor Polarity
N-Channel
Resistance Drain-source Rds (on)
9.5 mOhms
Drain-source Breakdown Voltage
80 V
Gate-source Breakdown Voltage
+/- 20 V
Continuous Drain Current
12 A
Power Dissipation
2.8 W
Maximum Operating Temperature
+ 150 C
Mounting Style
Through Hole
Fall Time
12 ns
Minimum Operating Temperature
- 40 C
Rise Time
20 ns
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
IRF6646
Manufacturer:
IR
Quantity:
712
Part Number:
IRF6646TR1PBF
Manufacturer:
OMRON
Quantity:
1 000
Part Number:
IRF6646TR1PBF
Manufacturer:
IR
Quantity:
8 000
Company:
Part Number:
IRF6646TR1PBF
Quantity:
865
Company:
Part Number:
IRF6646TRPBF
Quantity:
9 000
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Applicable DirectFET Outline and Substrate Outline (see p.7,8 for details)

ƒ
Description
The IRF6646 combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFET
lowest on-state resistance in a package that has the footprint of an SO-8 and only 0.7 mm profile. The DirectFET package is compatible with
existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering techniques,
when application note AN-1035 is followed regarding the manufacturing methods and processes. The DirectFET package allows dual sided
cooling to maximize thermal transfer in power systems, improving previous best thermal resistance by 80%.
The IRF6646 is optimized for primary side bridge topologies in isolated DC-DC applications, for 48V(±10%) or 36V to 60V ETSI input voltage
range systems, and is also ideal for secondary side synchronous rectification in regulated isolated DC-DC topologies. The reduced total losses
in the device coupled with the high level of thermal performance enables high efficiency and low temperatures, which are key for system reliability
improvements, and makes this device ideal for high performance isolated DC-DC converters.
www.irf.com
V
V
I
I
I
I
E
I
Absolute Maximum Ratings
D
D
D
DM
AR
DS
GS
AS
Dual Sided Cooling Compatible 
Ideal for High Performance Isolated Converter
Primary Switch Socket
Optimized for Synchronous Rectification
Compatible with existing Surface Mount Techniques 
RoHS compliant containing no lead or bromide 
Low Profile (<0.7 mm)
Ultra Low Package Inductance
Optimized for High Frequency Switching 
Low Conduction Losses
Click on this section to link to the appropriate technical paper.
Click on this section to link to the DirectFET Website.
Surface mounted on 1 in. square Cu board, steady state.
@ T
@ T
@ T
S Q
0.05
0.04
0.03
0.02
0.01
A
A
C
0
= 25°C
= 70°C
= 25°C
Fig 1. Typical On-Resistance vs. Gate Voltage
4
S X
T J = 25°C
V GS, Gate -to -Source Voltage (V)
6
Drain-to-Source Voltage
Gate-to-Source Voltage
Continuous Drain Current, V
Continuous Drain Current, V
Continuous Drain Current, V
Pulsed Drain Current
Single Pulse Avalanche Energy
Avalanche Current
8
S T
10
T J = 125°C
12
Ãg
g
Parameter
I D = 7.2A
14
M Q
GS
GS
GS
@ 10V
@ 10V
@ 10V
h
16
f
M X
T
Repetitive rating; pulse width limited by max. junction temperature.
Starting T
C
measured with thermocouple mounted to top (Drain) of part.
12.0
10.0
8.0
6.0
4.0
2.0
0.0
Fig 2.
M T

0
J
= 25°C, L = 8.8mH, R
I D = 7.2A
Typical Total Gate Charge vs. Gate-to-Source
80V max ±20V max
DirectFET™ Power MOSFET ‚
M N
Q
MN
V
36nC
Q G Total Gate Charge (nC)
10
g tot
DSS
V DS = 40V
V DS = 16V
Max.
Voltage
230
±20
9.6
7.2
80
12
68
96
G
20
12nC
= 25Ω, I
V
Q
TM
GS
gd
IRF6646
packaging to achieve the
DirectFET™ ISOMETRIC
AS
= 7.2A.
30
7.6mΩ@ 10V
R
V
3.8V
DS(on)
gs(th)
Units
mJ
11/04/05
V
A
A
40
1

Related parts for IRF6646

IRF6646 Summary of contents

Page 1

... The IRF6646 is optimized for primary side bridge topologies in isolated DC-DC applications, for 48V(±10%) or 36V to 60V ETSI input voltage range systems, and is also ideal for secondary side synchronous rectification in regulated isolated DC-DC topologies. The reduced total losses in the device coupled with the high level of thermal performance enables high efficiency and low temperatures, which are key for system reliability improvements, and makes this device ideal for high performance isolated DC-DC converters ...

Page 2

... IRF6646 Static @ T = 25°C (unless otherwise specified) J Parameter BV Drain-to-Source Breakdown Voltage DSS ∆ΒV /∆T Breakdown Voltage Temp. Coefficient DSS J R Static Drain-to-Source On-Resistance DS(on) V Gate Threshold Voltage GS(th) ∆V /∆T Gate Threshold Voltage Coefficient GS(th Drain-to-Source Leakage Current DSS I Gate-to-Source Forward Leakage ...

Page 3

... Peak Zthja + Tc 0.1 1 measured with thermocouple incontact with top (Drain) of part. J ƒ Mounted on minimum with footprint full size board with metalized back and with small clip heatsink (still air) IRF6646 Units W °C Units 45 ––– ––– °C/W 1.4 – ...

Page 4

... IRF6646 100 10 6.0V ≤ 60µs PULSE WIDTH Tj = 25° Drain-to-Source Voltage (V) Fig 4. Typical Output Characteristics 1000 10V ≤ 60µs PULSE WIDTH 100 150° 25° -40° Gate-to-Source Voltage (V) Fig 6. Typical Transfer Characteristics 10000 0V MHZ C iss = SHORTED C rss = oss = iss ...

Page 5

... Drain-to-Source Voltage (V) Fig11. Maximum Safe Operating Area 6.0 5.0 4.0 3.0 2.0 -75 -50 - Temperature ( °C ) Fig 13. Typical Threshold Voltage vs. Junction Temperature TOP 3.3A 4.0A 125 150 IRF6646 100µsec 1msec 10.00 100. 150µ 250µ 1.0mA 1.0A 100 125 150 5 ...

Page 6

... IRF6646 Current Regulator Same Type as D.U.T. 50KΩ .2µF 12V .3µ 3mA I G Current Sampling Resistors Fig 15a. Gate Charge Test Circuit D.U 20V GS 0.01 Ω Fig 16a. Unclamped Inductive Test Circuit ≤ 1 ≤ 0.1 % Fig 17a. Switching Time Test Circuit ...

Page 7

... Driver Gate Drive P.W. D.U.T. I Reverse Recovery „ Current - + D.U.T. V Re-Applied G + Voltage - Inductor Curent ® HEXFET Power MOSFETs P.W. Period D = Period Waveform SD Body Diode Forward Current di/dt Waveform DS Diode Recovery dv/dt Body Diode Forward Drop Ripple ≤ 5% for N-Channel IRF6646 V =10V ...

Page 8

... IRF6646 DirectFET™ Outline Dimension, MN Outline (Medium Size Can, N-Designation). Please see DirectFET application note AN-1035 for all details regarding the assembly of DirectFET. This includes all recommendations for stencil and substrate designs. DirectFET™ Part Marking 8 7I89 5 HIT9(Ã7IHTRIFFCHAÃ 6 CG9HSCIHSÃ5R9ÃCHÃGG ...

Page 9

... DirectFET™ Tape & Reel Dimension (Showing component orientation). NOTE: Controlling dimensions in mm Std reel quantity is 4800 parts. (ordered as IRF6646). For 1000 parts on 7" reel, order IRF6646TR1 CODE WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 www.irf.com ...

Page 10

Note: For the most current drawings please refer to the IR website at: http://www.irf.com/package/ ...

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