IRF6644 International Rectifier, IRF6644 Datasheet

MOSFET N-CH 100V DIRECTFET-MN

IRF6644

Manufacturer Part Number
IRF6644
Description
MOSFET N-CH 100V DIRECTFET-MN
Manufacturer
International Rectifier
Series
HEXFET®r
Datasheet

Specifications of IRF6644

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Standard
Rds On (max) @ Id, Vgs
13 mOhm @ 10.3A, 10V
Drain To Source Voltage (vdss)
100V
Current - Continuous Drain (id) @ 25° C
10.3A
Vgs(th) (max) @ Id
4.8V @ 150µA
Gate Charge (qg) @ Vgs
47nC @ 10V
Input Capacitance (ciss) @ Vds
2210pF @ 25V
Power - Max
2.8W
Mounting Type
Surface Mount
Package / Case
DirectFET™ Isometric MN
Configuration
Single Quad Drain Dual Source
Transistor Polarity
N-Channel
Resistance Drain-source Rds (on)
13 m Ohms
Drain-source Breakdown Voltage
100 V
Gate-source Breakdown Voltage
+/- 20 V
Continuous Drain Current
10.3 A
Power Dissipation
2.8 W
Maximum Operating Temperature
+ 150 C
Mounting Style
Through Hole
Fall Time
16 ns
Minimum Operating Temperature
- 40 C
Rise Time
26 ns
Lead Free Status / Rohs Status
No

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Company
Part Number
Manufacturer
Quantity
Price
Part Number:
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Manufacturer:
MOLEX
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Part Number:
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Manufacturer:
IR
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20 000
Part Number:
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IR
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Applicable DirectFET Outline and Substrate Outline (see p.7,8 for details)

ƒ
Description
The IRF6644 combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFET
lowest on-state resistance in a package that has the footprint of an SO-8 and only 0.7 mm profile. The DirectFET package is compatible with
existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering techniques,
when application note AN-1035 is followed regarding the manufacturing methods and processes. The DirectFET package allows dual sided
cooling to maximize thermal transfer in power systems, improving previous best thermal resistance by 80%.
The IRF6644 is optimized for primary side bridge topologies in isolated DC-DC applications, for wide range universal input Telecom applications
(36V - 75V), and for secondary side synchronous rectification in regulated DC-DC topologies. The reduced total losses in the device coupled
with the high level of thermal performance enables high efficiency and low temperatures, which are key for system reliability improvements,
and makes this device ideal for high performance isolated DC-DC converters.
www.irf.com
Absolute Maximum Ratings
V
V
I
I
I
I
E
I
D
D
D
DM
AR
DS
GS
AS
RoHs Compliant Containing No Lead and Bromide 
Low Profile (<0.7 mm)
Dual Sided Cooling Compatible 
Ultra Low Package Inductance
Optimized for High Frequency Switching 
Ideal for High Performance Isolated Converter
Primary Switch Socket
Optimized for Synchronous Rectification
Low Conduction Losses
Compatible with existing Surface Mount Techniques 
Click on this section to link to the appropriate technical paper.
Click on this section to link to the DirectFET Website.
Surface mounted on 1 in. square Cu board, steady state.
@ T
@ T
@ T
SH
A
A
C
0.08
0.06
0.04
0.02
0.00
= 25°C
= 70°C
= 25°C
Fig 1. Typical On-Resistance Vs. Gate Voltage
4
SJ
V GS , Gate-to-Source Voltage (V)
6
Drain-to-Source Voltage
Gate-to-Source Voltage
Continuous Drain Current, V
Continuous Drain Current, V
Continuous Drain Current, V
Pulsed Drain Current
Single Pulse Avalanche Energy
Avalanche Current
8
SP
T J = 125°C
T J = 25°C
10
12
Ãg
I D = 6.2A
g
Parameter
14
GS
GS
GS
MZ
@ 10V
@ 10V
@ 10V
16
h
f
MN
T
Repetitive rating; pulse width limited by max. junction temperature.
Starting T
C
measured with thermocouple mounted to top (Drain) of part.
13
12
11
10
9

J
= 25°C, L = 12mH, R
0
Fig 2. Typical On-Resistance Vs. Drain Current
T A = 25°C
100V max ±20V max 10.3mΩ@ 10V
DirectFET™ Power MOSFET ‚
Q
MN
V
35nC
4
g tot
DSS
I D , Drain Current (A)
Max.
10.3
100
220
±20
8.3
6.2
60
82
8
G
V GS = 7.0V
11.5nC
V GS = 8.0V
V GS = 10V
V GS = 15V
= 25Ω, I
V
Q
TM
GS
gd
12
IRF6644
packaging to achieve the
DirectFET™ ISOMETRIC
AS
= 6.2A.
16
R
V
3.7V
DS(on)
gs(th)
Units
mJ
V
A
A
20
1
6/30/05

Related parts for IRF6644

IRF6644 Summary of contents

Page 1

... The IRF6644 is optimized for primary side bridge topologies in isolated DC-DC applications, for wide range universal input Telecom applications (36V - 75V), and for secondary side synchronous rectification in regulated DC-DC topologies. The reduced total losses in the device coupled with the high level of thermal performance enables high efficiency and low temperatures, which are key for system reliability improvements, and makes this device ideal for high performance isolated DC-DC converters ...

Page 2

... IRF6644 Static @ T = 25°C (unless otherwise specified) J Parameter BV Drain-to-Source Breakdown Voltage DSS ∆ΒV /∆T Breakdown Voltage Temp. Coefficient DSS J R Static Drain-to-Source On-Resistance DS(on) V Gate Threshold Voltage GS(th) ∆V /∆T Gate Threshold Voltage Coefficient GS(th Drain-to-Source Leakage Current DSS I Gate-to-Source Forward Leakage ...

Page 3

... Rectangular Pulse Duration (sec) „ T measured with thermocouple incontact with top (Drain) of part. C … measured at θ ƒ small clip heatsink (still air) IRF6644 Max. 2.8 1.8 89 270 - 150 Typ. Max. ––– 45 12.5 ––– 20 ––– ...

Page 4

... IRF6644 100 6.0V 10 ≤ 60µs PULSE WIDTH Tj = 25° Drain-to-Source Voltage (V) Fig 4. Typical Output Characteristics 100. 150° 25°C 10. -40°C 1.00 0. 10V ≤ 60µs PULSE WIDTH 0.01 3.0 4.0 5 Gate-to-Source Voltage (V) Fig 6. Typical Transfer Characteristics 100000 0V MHZ C iss = SHORTED ...

Page 5

... Fig 14. Maximum Avalanche Energy Vs. Drain Current www.irf.com 4.0 5.0 125 150 1000 TOP 800 BOTTOM 600 400 200 100 Starting Junction Temperature (°C) IRF6644 1000 OPERATION IN THIS AREA LIMITED (on) 100 100µsec 10 1msec 100msec 1 10msec 25° 150°C Single Pulse 0.1 0.01 0.10 1.00 10. Drain-toSource Voltage (V) Fig11 ...

Page 6

... IRF6644 Current Regulator Same Type as D.U.T. 50KΩ .2µF 12V .3µ 3mA I G Current Sampling Resistors Fig 15a. Gate Charge Test Circuit D.U 20V GS 0.01 Ω Fig 16b. Unclamped Inductive Test Circuit ≤ 1 ≤ 0.1 % Fig 17a. Switching Time Test Circuit ...

Page 7

... D.U.T. I Reverse Recovery „ Current - + D.U.T. V Re-Applied G + Voltage - Inductor Curent ® HEXFET Power MOSFETs P.W. Period D = Period Waveform SD Body Diode Forward Current di/dt Waveform DS Diode Recovery dv/dt Body Diode Forward Drop Ripple ≤ 5% for N-Channel G = GATE D = DRAIN S = SOURCE D D IRF6644 V =10V ...

Page 8

... IRF6644 DirectFET™ Outline Dimension, MN Outline (Medium Size Can, N-Designation). Please see DirectFET application note AN-1035 for all details regarding the assembly of DirectFET. This includes all recommendations for stencil and substrate designs. NOTE: CONTROLLING DIMENSIONS ARE IN MM DirectFET™ Part Marking ...

Page 9

... DirectFET™ Tape & Reel Dimension (Showing component orientation). NOTE: Controlling dimensions in mm Std reel quantity is 4800 parts. (ordered as IRF6644). For 1000 parts on 7" reel, order IRF6644TR1 CODE WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 www.irf.com ...

Page 10

Note: For the most current drawings please refer to the IR website at: http://www.irf.com/package/ ...

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