ISL6609A Intersil Corporation, ISL6609A Datasheet
ISL6609A
Available stocks
Related parts for ISL6609A
ISL6609A Summary of contents
Page 1
... Data Sheet Synchronous Rectified MOSFET Driver The ISL6609, ISL6609A is a high frequency, MOSFET driver optimized to drive two N-Channel power MOSFETs in a synchronous-rectified buck converter topology. This driver combined with an Intersil ISL63xx or ISL65xx multiphase PWM controller forms a complete single-stage core-voltage regulator solution with high efficiency performance at high switching frequency for advanced microprocessors ...
Page 2
... VCC 5 LGATE ISL6609 and ISL6609A R BOOT SHOOT- 4.25K THROUGH PROTECTION CONTROL LOGIC 4K ) AVAILABLE ONLY IN ISL6609A BOOT PACKAGE (Pb-Free SOIC 8 Ld 3x3 QFN 8 Ld SOIC 8 Ld 3x3 QFN 8 Ld SOIC 8 Ld 3x3 QFN 8 Ld SOIC 8 Ld 3x3 QFN ISL6609, ISL6609A (QFN) ...
Page 3
... VCC VSEN PWM1 PWM2 PGOOD PWM CONTROL (ISL63XX or ISL65XX) ISEN1 VID (OPTIONAL) ISEN2 FS/EN GND R IS REQUIRED FOR SPECIAL POWER SEQUENCING APPLICATIONS UGPH 3 ISL6609, ISL6609A +5V BOOT VCC EN UGATE PWM ISL6609 PHASE LGATE +5V BOOT VCC EN UGATE PWM ISL6609 PHASE LGATE (SEE APPLICATION INFORMATION SECTION ON PAGE 8) ...
Page 4
... LGATE Rise Time (Note 4) UGATE Fall Time (Note 4) LGATE Fall Time (Note 4) UGATE Turn-Off Propagation Delay LGATE Turn-Off Propagation Delay 4 ISL6609, ISL6609A Thermal Information Thermal Resistance (Notes SOIC Package (Note QFN Package (Notes 2, 3 -0. (DC) Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150°C -0. (< ...
Page 5
... Three-state PWM Input section for further details. Connect this pin to the PWM output of the controller. GND (Pin 4) Ground pin. All signals are referenced to this node. 5 ISL6609, ISL6609A = -40°C to 100°C, unless otherwise noted (Continued) A SYMBOL TEST CONDITIONS t ...
Page 6
... PWM line of ISL6609/09A (assuming an Intersil PWM controller is used). Bootstrap Considerations This driver features an internal bootstrap diode. Simply adding an external capacitor across the BOOT and PHASE pins completes the bootstrap circuit. The ISL6609A’s internal t TSSHD PTS FN9221 ...
Page 7
... Calculating the power dissipation in the driver for a desired application is critical to ensure safe operation. Exceeding the maximum 7 ISL6609, ISL6609A allowable power dissipation level will push the IC beyond the maximum recommended operating junction temperature of 125°C. The maximum allowable IC power dissipation for the ...
Page 8
... The selection of D -PAK, or D-PAK packaged MOSFETs much better match (for the reasons discussed) for the ISL6609A. Low-profile MOSFETs, such as Direct FETs and multi-SOURCE leads devices (SO-8, LFPAK, PowerPAK), have low parasitic lead inductances and can be driven by either ISL6609 or ISL6609A (assuming proper layout design). The ISL6609, missing the 3Ω ...
Page 9
... rss GD UGPH GI VCC BOOT C BOOT DU G UGATE DL PHASE FIGURE 5. GATE TO SOURCE RESISTOR TO REDUCE UPPER MOSFET MILLER COUPLING 9 ISL6609, ISL6609A DS ⋅ iss (EQ. 5) iss GD GS VIN ...
Page 10
... Quad Flat No-Lead Plastic Package (QFN) Micro Lead Frame Plastic Package (MLFP) 10 ISL6609, ISL6609A L8.3x3 8 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220VEEC ISSUE C) SYMBOL MIN 0. θ - NOTES: 1. Dimensioning and tolerancing conform to ASME Y14.5-1994. ...
Page 11
... However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 11 ISL6609, ISL6609A M8.15 (JEDEC MS-012-AA ISSUE C) 8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE ...