MP3V5004G Freescale Semiconductor, MP3V5004G Datasheet

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MP3V5004G

Manufacturer Part Number
MP3V5004G
Description
Integrated Silicon Pressure Sensor On-Chip Signal Conditioned
Manufacturer
Freescale Semiconductor
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MP3V5004GC6U
Manufacturer:
FREESCALE
Quantity:
20 000
Part Number:
MP3V5004GP
Manufacturer:
SKYWORKS
Quantity:
1 000
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Freescale Semiconductor
Technical Data
© Freescale Semiconductor, Inc., 2008. All rights reserved.
Integrated Silicon Pressure Sensor
On-Chip Signal Conditioned,
Temperature Compensated and
Calibrated
monolithic silicon pressure sensor designed for a wide range of applications, but
particularly those employing a microcontroller or microprocessor with A/D inputs.
This sensor combines a highly sensitive implanted strain gauge with advanced
micromachining techniques, thin-film metallization, and bipolar processing to
provide an accurate, high level analog output signal that is proportional to the
applied pressure.
Features
Typical Applications
Through-
Hole
Surface
Mount
1. MP3V5004G series pressure sensors are available with a pressure port. Three
The MP3V5004G series piezoresistive transducer is a state-of-the-art
Device
Temperature Compensated over 10° to 60°C
Available in Gauge Surface Mount (SMT) or Through-Hole (DIP)
Configurations
Durable Thermoplastic (PPS) Package
Washing Machine Water Level
Ideally Suited for Microprocessor or Microcontroller-Based Systems
packing options are offered for the surface mount configuration.
Type
Case
482C
482A
482A
1351
1368
1369
No.
MP3V5004GC6U
CASE 482A-01
ORDERING INFORMATION
MP3V5004GC6T1
MP3V5004GC7U
MP3V5004GC6U
MP3V5004GVP
MPXV Series
MP3V5004DP
MP3V5004GP
Order No.
CASE 1351-01
MP3V5004DP
Tape & Reel
SMALL OUTLINE PACKAGES
Packing
Options
Trays
Trays
Trays
Rails
Rails
(1)
SURFACE MOUNT
MP3V5004G
MP3V5004G
MP3V5004G
MP3V5004G
MP3V5004G
MP3V5004G
Marking
Device
MP3V5004GVP
CASE 1368-01
1. Pins 1, 5, 6, 7, and 8 are internal device
connections. Do not connect to external
circuitry or ground. Pin 1 is noted by the
notch in the lead.
SMALL OUTLINE PACKAGES
1
2
3
4
0.6 TO 3.0 V OUTPUT
PRESSURE SENSOR
MP3V5004G
(0 TO 400 mm H
CASE 1369-01
MP3V5004GP
THROUGH-HOLE
PIN NUMBERS
0 TO 3.92 kPA
MP3V5004GC7U
INTEGRATED
CASE 482C-03
SERIES
GND
V
N/C
V
OUT
S
Rev 0, 11/2008
5
6
7
8
2
MP3V5004G
(1)
O)
N/C
N/C
N/C
N/C

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MP3V5004G Summary of contents

Page 1

... MP3V5004GC6T1 1351 MP3V5004DP 1368 MP3V5004GVP 1369 MP3V5004GP 1. MP3V5004G series pressure sensors are available with a pressure port. Three packing options are offered for the surface mount configuration. MP3V5004GC6U CASE 482A-01 © Freescale Semiconductor, Inc., 2008. All rights reserved. (1) Packing Device Options ...

Page 2

... Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span percent Auto Zero at Factory Installation: Due to the sensitivity of the MP3V5004G, external mechanical stresses and mounting position can affect the zero pressure output reading. Autozeroing is defined as storing the zero pressure output reading and subtracting this from the device's output during normal operations. Reference AN1636 for specific information. The specified accuracy assumes a maximum temperature change of ± ...

Page 3

... Sensors Freescale Semiconductor from the factory. Contact the factory for information regarding media tolerance in your application. Figure 3 interfacing the output of the MP3V5004G to the A/D input of the microprocessor or microcontroller. Proper decoupling of the power supply is recommended. Figure 4 pressure input. Typical, minimum and maximum output curves are shown for operation over a temperature range of 10° ...

Page 4

... MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface MP3V5004G 4 Freescale Semiconductor pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. ...

Page 5

... INCHES MILLIMETERS DIM MIN MAX MIN MAX A 0.415 0.425 10.54 10.79 B 0.415 0.425 10.54 10.79 C 0.500 0.520 12.70 13.21 D 0.038 0.042 0.96 1.07 G 0.100 BSC 2.54 BSC H 0.002 0.010 0.05 0.25 J 0.009 0.011 0.23 0.28 K 0.061 0.071 1.55 1.80 M 0˚ 7˚ 0˚ 7˚ N 0.444 0.448 11.28 11.38 S 0.709 0.725 18.01 18. 0.245 0.255 6.22 6.48 W 0.115 0.125 2.92 3.17 -T- SEATING PLANE MP3V5004G 5 ...

Page 6

... N - MP3V5004G 6 PACKAGE DIMENSIONS 0.25 (0.010 DETAIL PIN 1 IDENTIFIER DETAIL X CASE 482C-03 ISSUE B SMALL OUTLINE PACKAGE THROUGH-HOLE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION ...

Page 7

... Sensors Freescale Semiconductor PACKAGE DIMENSIONS CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE SURFACE MOUNT PAGE MP3V5004G 7 ...

Page 8

... MP3V5004G 8 PACKAGE DIMENSIONS CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE PAGE Sensors Freescale Semiconductor ...

Page 9

... Sensors Freescale Semiconductor PACKAGE DIMENSIONS CASE 1368-01 ISSUE B SMALL OUTLINE PACKAGE SURFACE MOUNT PAGE MP3V5004G 9 ...

Page 10

... MP3V5004G 10 PACKAGE DIMENSIONS CASE 1368-01 ISSUE B SMALL OUTLINE PACKAGE SURFACE MOUNT PAGE Sensors Freescale Semiconductor ...

Page 11

... Sensors Freescale Semiconductor PACKAGE DIMENSIONS CASE 1368-01 ISSUE B SMALL OUTLINE PACKAGE SURFACE MOUNT PAGE MP3V5004G 11 ...

Page 12

... MP3V5004G 12 PACKAGE DIMENSIONS CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE PAGE Sensors Freescale Semiconductor ...

Page 13

... Sensors Freescale Semiconductor PACKAGE DIMENSIONS CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE PAGE MP3V5004G 13 ...

Page 14

... Freescale Semiconductor Literature Distribution Center P.O. Box 5405 Denver, Colorado 80217 1-800-441-2447 or +1-303-675-2140 Fax: +1-303-675-2150 LDCForFreescaleSemiconductor@hibbertgroup.com MP3V5004G Rev. 0 11/2008 Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document ...

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