SPP80N06S-08 Infineon Technologies, SPP80N06S-08 Datasheet

no-image

SPP80N06S-08

Manufacturer Part Number
SPP80N06S-08
Description
MOSFET N-CH 55V 80A TO-220
Manufacturer
Infineon Technologies
Series
SIPMOS®r
Datasheet

Specifications of SPP80N06S-08

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Standard
Rds On (max) @ Id, Vgs
8 mOhm @ 80A, 10V
Drain To Source Voltage (vdss)
55V
Current - Continuous Drain (id) @ 25° C
80A
Vgs(th) (max) @ Id
4V @ 250µA
Gate Charge (qg) @ Vgs
187nC @ 10V
Input Capacitance (ciss) @ Vds
3660pF @ 25V
Power - Max
300W
Mounting Type
Through Hole
Package / Case
TO-220-3 (Straight Leads)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
SP000054054
SPP80N06S08
Rev. 1.0
Features
• N-channel - Normal Level -Enhancement mode
• Automotive AEC Q101 qualified
• MSL1 up to 260°C peak reflow
• 175°C operating temperature
• Avalanche test
• Repetive Avalanche up to
• dv /dt rated
Maximum ratings, at T
Parameter
Continuous drain current
Pulsed drain current
Avalanche energy, single pulse
Avalanche energy, periodic
Reverse diode dv /dt
Gate source voltage
Power dissipation
Operating and storage temperature
IEC climatic category; DIN IEC 68-1
SIPMOS
Type
SPB80N06S-08
SPI80N06S-08
SPP80N06S-08
T
jmax
= 175 °C
®
Power-Transistor
2)
2)
j
Package
PG-TO263-3-2
PG-TO262-3-1
PG-TO220-3-1
=25 °C, unless otherwise specified
1)
2)
PG-TO263-3-2
Symbol Conditions
I
I
E
E
dv /dt
V
P
T
D
D,pulse
j
AS
AR
GS
tot
, T
Ordering Code
SP0000-84808
SP0000-82518
SP0000-84809
stg
V
T
T
T
T
T
I
V
T
I
di /dt =200 A/µs,
T
T
D
D
DD
C
C
C
C
C
j
j,max
C
DD
=80 A, R
=175 °C
=80 A, V
page 1
=25 °C, V
=100 °C, V
=25 °C, V
=100 °C, V
=25 °C
=25 °C
=30 V, I
=25 V
=175 °C
DS
GS
D
=80 A, V
PG-TO262-3-1
GS
GS
=40 V,
=25 ,
Product Summary
V
R
I
Marking
1N0608
1N0608
1N0608
GS
GS
D
=10 V
=10 V
DS
DS(on),max
=10 V
=10 V
GS
SPI80N06S-08, SPP80N06S-08
=10 V, R
Green Package
(SMD version)
-55 ... +175
G
55/175/56
=2.4
Value
320
700
±20
300
80
80
30
PG-TO220-3-1
6
SPB80N06S-08
7.7
55
80
2005-06-28
Unit
A
mJ
kV/µs
V
W
°C
V
m
A

Related parts for SPP80N06S-08

SPP80N06S-08 Summary of contents

Page 1

... V = =100 ° =25 °C D,pulse =175 ° = = /dt di /dt =200 A/µs, T =175 °C j,max =25 °C tot stg page 1 SPB80N06S-08 SPI80N06S-08, SPP80N06S-08 55 (SMD version) 7.7 80 Green Package PG-TO220-3 Value Unit 320 700 kV/µs ±20 V 300 W -55 ... +175 °C 55/175/56 2005-06- ...

Page 2

... (BR)DSS =240 µA GS(th = DSS T =25 ° = =150 ° = GSS = =80 A DS( SMD version |V |>2 DS(on)max = page 2 SPB80N06S-08 SPI80N06S-08, SPP80N06S-08 Values min. typ. max. - 0.38 0 2 100 = 100 - 6.5 - 6.2 7 Unit K µ 2005-06-28 ...

Page 3

... plateau =25 ° S,pulse = =25 ° =27 /dt =100 A/µ =0.5 K/W the chip is able to carry 132A at 25°C. For detailed thJC 2 (one layer, 70 µm thick) copper area for drain page 3 SPB80N06S-08 SPI80N06S-08, SPP80N06S-08 Values min. typ. max. - 3660 = 1075 - 540 - =2 125 - 5 0 105 ...

Page 4

... V DS Rev. 1.0 2 Drain current I =f 100 150 200 4 Max. transient thermal impedance Z =f(t thJC parameter µs 10 100 µ 100 [V] page 4 SPB80N06S-08 SPI80N06S-08, SPP80N06S- = 100 T [° 0.5 0.2 0.1 0.05 0.02 0.01 single pulse - [s] p 150 200 - 2005-06-28 ...

Page 5

... DS 7 Typ. transfer characteristics I =f |>2 DS(on)max parameter 160 140 120 100 175 ° Rev. 1.0 6 Typ. drain-source on resistance R =f(I DS(on) parameter [V] 8 Typ. forward transconductance g =f ° [V] page 5 SPB80N06S-08 SPI80N06S-08, SPP80N06S- =25 ° 4 [ =25 ° [ 5 6 100 120 60 80 2005-06-28 ...

Page 6

... Rev. 1.0 10 Typ. gate threshold voltage V =f(T GS(th) parameter 3.5 3 2.5 2 1.5 1 0.5 100 140 180 12 Forward characteristics of reverse diode I =f parameter: T Crss 30 40 [V] page 6 SPB80N06S-08 SPI80N06S-08, SPP80N06S- µA 1200 µA 240 -60 - 100 T [° °C 175 °C 0 0.2 0.4 0.6 0 [V] ...

Page 7

... Rev. 1.0 14 Typ. Avalanche Energy E =f(T AS parameter: I 800 C °25 700 C °100 600 500 400 300 200 100 0 100 1000 16 Drain-source breakdown voltage V BR(DSS 100 120 140 [nC] page 7 SPB80N06S-08 SPI80N06S-08, SPP80N06S- = 100 150 T [° =250 µ -60 - 100 T [°C] j 200 140 180 2005-06-28 ...

Page 8

... Life support devices or systems are intended to be implanted in the human body support and/or maintain and sustain and/or protect human life. If they fail reasonable to assume that the health of the user or other persons may be endangered. Rev. 1.0 SPI80N06S-08, SPP80N06S-08 page 8 SPB80N06S-08 2005-06-28 ...

Related keywords