PESD1LIN,115 NXP Semiconductors, PESD1LIN,115 Datasheet - Page 7

• Manufacturer Part Number: PESD1LIN,115
• Description: DIODE ESD PROTECTION SOD323
• Manufacturer: NXP Semiconductors

Specifications of PESD1LIN,115

• Package / Case: SC-76, SOD-323, UMD2
• Voltage - Reverse Standoff (typ): 15V
• Voltage - Breakdown: 17.1V
• Power (watts): 160W
• Polarization: Bidirectional
• Mounting Type: Surface Mount
• Polarity: Bidirectional
• Clamping Voltage: 25 V
• Operating Voltage: 24 V
• Breakdown Voltage: 18.9 V
• Termination Style: SMD/SMT
• Peak Surge Current: 3 A
• Peak Pulse Power Dissipation: 160 W
• Capacitance: 17 pF
• Maximum Operating Temperature: + 150 C
• Minimum Operating Temperature: - 65 C
• Dimensions: 1.35 mm W x 2.7 mm L x 1.1 mm H
• Number Of Elements: 1
• Operating Temperature Classification: Military
• Reverse Breakdown Voltage: 25.4V
• Reverse Stand-off Voltage: 24V
• Leakage Current (max): 50nA
• Peak Pulse Current: 3A
• Test Current (it): 5mA
• Operating Temp Range: -65C to 150C
• Mounting: Surface Mount
• Pin Count: 2
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 568-4033-2; 934058897115; PESD1LIN T/R; PESD1LIN T/R

NXP Semiconductors
8. Package outline
9. Packing information
PESD1LIN_2
Product data sheet
Table 9.
The indicated -xxx are the last three digits of the 12NC ordering code.
[1]
Type number Package Description
PESD1LIN
Fig 7.
For further information and the availability of packing methods, see
Package outline SOD323 (SC-76)
Packing methods
SOD323
Rev. 02 — 12 November 2008
Dimensions in mm
2.7
2.3
4 mm pitch, 8 mm tape and reel
1.8
1.6
1.35
1.15
1
2
0.40
0.25
0.45
0.15
LIN bus ESD protection diode
Section
0.25
0.10
1.1
0.8
[1]
03-12-17
13.
PESD1LIN
Packing quantity
3000
-115
© NXP B.V. 2008. All rights reserved.
10000
-135
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