PESD1LIN,115 NXP Semiconductors, PESD1LIN,115 Datasheet - Page 8

• Manufacturer Part Number: PESD1LIN,115
• Description: DIODE ESD PROTECTION SOD323
• Manufacturer: NXP Semiconductors

Specifications of PESD1LIN,115

• Package / Case: SC-76, SOD-323, UMD2
• Voltage - Reverse Standoff (typ): 15V
• Voltage - Breakdown: 17.1V
• Power (watts): 160W
• Polarization: Bidirectional
• Mounting Type: Surface Mount
• Polarity: Bidirectional
• Clamping Voltage: 25 V
• Operating Voltage: 24 V
• Breakdown Voltage: 18.9 V
• Termination Style: SMD/SMT
• Peak Surge Current: 3 A
• Peak Pulse Power Dissipation: 160 W
• Capacitance: 17 pF
• Maximum Operating Temperature: + 150 C
• Minimum Operating Temperature: - 65 C
• Dimensions: 1.35 mm W x 2.7 mm L x 1.1 mm H
• Number Of Elements: 1
• Operating Temperature Classification: Military
• Reverse Breakdown Voltage: 25.4V
• Reverse Stand-off Voltage: 24V
• Leakage Current (max): 50nA
• Peak Pulse Current: 3A
• Test Current (it): 5mA
• Operating Temp Range: -65C to 150C
• Mounting: Surface Mount
• Pin Count: 2
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 568-4033-2; 934058897115; PESD1LIN T/R; PESD1LIN T/R

NXP Semiconductors
10. Soldering
PESD1LIN_2
Product data sheet
Fig 8.
Fig 9.
1.65
2.75
(2 )
Reflow soldering footprint SOD323 (SC-76)
Wave soldering footprint SOD323 (SC-76)
0.95
1.2
(2 )
(2 )
0.5
0.6
Rev. 02 — 12 November 2008
1.5 (2 )
3.05
2.1
2.2
2.9
5
0.5 (2 )
0.6 (2 )
LIN bus ESD protection diode
direction during soldering
Dimensions in mm
Dimensions in mm
PESD1LIN
preferred transport
© NXP B.V. 2008. All rights reserved.
solder lands
solder resist
occupied area
solder lands
solder resist
solder paste
occupied area
sod323_fw
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