PESD5V0L5UV,115 NXP Semiconductors, PESD5V0L5UV,115 Datasheet - Page 12

• Manufacturer Part Number: PESD5V0L5UV,115
• Description: DIODE ESD PROTECT 5FOLD SS Mini6
• Manufacturer: NXP Semiconductors

Specifications of PESD5V0L5UV,115

• Package / Case: SS Mini-6 (SOT-666)
• Voltage - Reverse Standoff (typ): 5V
• Voltage - Breakdown: 6.4V
• Power (watts): 25W
• Polarization: 5 Channel Array - Unidirectional
• Mounting Type: Surface Mount
• Polarity: Unidirectional
• Clamping Voltage: 12 V
• Operating Voltage: 5 V
• Breakdown Voltage: 6.4 V
• Peak Surge Current: 2.5 A
• Peak Pulse Power Dissipation: 25 W
• Maximum Operating Temperature: + 150 C
• Minimum Operating Temperature: - 65 C
• Dimensions: 1.3(Max) mm W x 1.7(Max) mm L
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 568-4800-2; PESD5V0L5UV T/R; PESD5V0L5UV T/R; PESD5V0L5UV,115

NXP Semiconductors
9. Packing information
Table 10.
The indicated -xxx are the last three digits of the 12NC ordering code.
[1]
[2]
[3]
[4]
10. Soldering
PESDXL5UF_V_Y_2
Product data sheet
Type number
PESD3V3L5UF
PESD5V0L5UF
PESD3V3L5UV
PESD5V0L5UV
PESD3V3L5UY
PESD5V0L5UY
For further information and the availability of packing methods, see
T1: normal taping
T4: 90 rotated reverse taping
T2: reverse taping
Packing methods
Package
SOT886
SOT886
SOT666
SOT666
SOT363
SOT363
Fig 14. Reflow soldering footprint PESDxL5UF (SOT886)
Description
4 mm pitch, 8 mm tape and reel; T1
4 mm pitch, 8 mm tape and reel; T4
4 mm pitch, 8 mm tape and reel; T1
4 mm pitch, 8 mm tape and reel; T4
2 mm pitch, 8 mm tape and reel
4 mm pitch, 8 mm tape and reel
2 mm pitch, 8 mm tape and reel
4 mm pitch, 8 mm tape and reel
4 mm pitch, 8 mm tape and reel; T1
4 mm pitch, 8 mm tape and reel; T2
4 mm pitch, 8 mm tape and reel; T1
4 mm pitch, 8 mm tape and reel; T2
Reflow soldering is the only recommended soldering method.
Low capacitance unidirectional fivefold ESD protection diode arrays
0.370
0.270
(6 )
(6 )
Rev. 02 — 8 January 2008
0.325
(6 )
1.250
0.675
Section
0.425
(6
[1]
13.
0.500
0.500
[2]
[3]
[2]
[3]
[2]
[4]
[2]
[4]
1.700
Packing quantity
3000
-
-
-
-
-
-
-
-
-115
-125
-115
-125
PESDxL5UF/V/Y
Dimensions in mm
4000
-
-
-
-
-
-115
-
-115
-
-
-
-
solder lands
solder paste
occupied area
5000
-115
-132
-115
-132
-
-
-
-
-
-
-
-
sot886_fr
© NXP B.V. 2008. All rights reserved.
8000
-
-
-
-
-315
-
-315
-
-
-
-
-
10000
-
-
-
-
-
-
-
-
-135
-165
-135
-165
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