DSPIC30F3013-20I/SO Microchip Technology, DSPIC30F3013-20I/SO Datasheet - Page 148

• Manufacturer Part Number: DSPIC30F3013-20I/SO
• Description: IC DSPIC MCU/DSP 24K 28SOIC
• Manufacturer: Microchip Technology
• Series: dsPIC™ 30Fr

Specifications of DSPIC30F3013-20I/SO

• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 20 MIPS
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 20
• Program Memory Size: 24KB (8K x 24)
• Program Memory Type: FLASH
• Eeprom Size: 1K x 8
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 5.5 V
• Data Converters: A/D 10x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-SOIC (7.5mm Width)
• Core Frequency: 40MHz
• Core Supply Voltage: 5.5V
• Embedded Interface Type: I2C, SPI, UART
• No. Of I/o's: 20
• Flash Memory Size: 24KB
• Supply Voltage Range: 2.5V To 5.5V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT28SO-1 - SOCKET TRANSITION 28SOIC 300MIL
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: DSPIC30F301320ISO

dsPIC30F2011/2012/3012/3013
TABLE 20-2:
TABLE 20-3:
TABLE 20-4:
DS70139F-page 148
dsPIC30F201x-30I
dsPIC30F301x-30I
dsPIC30F201x-20E
dsPIC30F301x-20E
Power Dissipation:
Internal chip power dissipation:
I/O Pin power dissipation:
Maximum Allowed Power Dissipation
Package Thermal Resistance, 18-pin PDIP (P)
Package Thermal Resistance, 18-pin SOIC (SO)
Package Thermal Resistance, 28-pin SPDIP (SP)
Package Thermal Resistance, 28-pin (SOIC)
Package Thermal Resistance, 44-pin QFN
Note 1:
DC CHARACTERISTICS
Operating Voltage
DC10
DC11
DC12
DC16
DC17
Note 1:
Param
No.
2:
3:
Operating Junction Temperature Range
Operating Junction Temperature Range
Operating Ambient Temperature Range
Operating Ambient Temperature Range
P
P
V
V
V
V
S
I
Symbol
INT
/
Junction to ambient thermal resistance, Theta-ja (θ
“Typ” column data is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
These parameters are characterized but not tested in manufacturing.
This is the limit to which V
DD
DD
DR
POR
VDD
O
=
=
∑
V
(
THERMAL OPERATING CONDITIONS
THERMAL PACKAGING CHARACTERISTICS
DC TEMPERATURE AND VOLTAGE SPECIFICATIONS
{
DD
(2)
V
Supply Voltage
Supply Voltage
RAM Data Retention Voltage
V
internal Power-on Reset signal)
V
internal Power-on Reset signal)
×
D D
DD
DD
(
I
–
DD
Start Voltage (to ensure
Rise Rate (to ensure
V
Characteristic
–
O H
∑
} I
Rating
Characteristic
I
×
OH
OH
)
)
DD
+
∑
can be lowered without losing RAM data.
(
V
OL
×
I
OL
(3)
)
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature
1.75
0.05
Min
2.5
3.0
—
JA
) numbers are achieved by package simulations.
Typ
—
—
—
—
—
Symbol
Symbol
P
(1)
DMAX
θ
θ
θ
θ
θ
P
T
T
T
T
JA
JA
JA
JA
JA
A
A
D
J
J
Max
V
5.5
5.5
—
—
SS
Min
Typ
-40
-40
-40
-40
44
57
42
49
28
-40°C ≤ T
-40°C ≤ T
Units
V/ms 0-5V in 0.1 sec
V
V
V
V
(T
© 2008 Microchip Technology Inc.
P
J
INT
Industrial temperature
Extended temperature
0-3V in 60 ms
- T
Max
Typ
A
A
—
—
—
—
—
—
—
—
—
+ P
A
≤ +85°C for Industrial
≤ +125°C for Extended
) / θ
I
/
O
Conditions
JA
°C/W
°C/W
°C/W
°C/W
°C/W
+125
+150
+125
Max
Unit
+85
Notes
Unit
°C
°C
°C
°C
W
W
1
1
1
1
1