DSPIC30F3013-20I/SO Microchip Technology, DSPIC30F3013-20I/SO Datasheet - Page 195

• Manufacturer Part Number: DSPIC30F3013-20I/SO
• Description: IC DSPIC MCU/DSP 24K 28SOIC
• Manufacturer: Microchip Technology
• Series: dsPIC™ 30Fr

Specifications of DSPIC30F3013-20I/SO

• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 20 MIPS
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 20
• Program Memory Size: 24KB (8K x 24)
• Program Memory Type: FLASH
• Eeprom Size: 1K x 8
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 5.5 V
• Data Converters: A/D 10x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-SOIC (7.5mm Width)
• Core Frequency: 40MHz
• Core Supply Voltage: 5.5V
• Embedded Interface Type: I2C, SPI, UART
• No. Of I/o's: 20
• Flash Memory Size: 24KB
• Supply Voltage Range: 2.5V To 5.5V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT28SO-1 - SOCKET TRANSITION 28SOIC 300MIL
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: DSPIC30F301320ISO

APPENDIX A:
Revision D (August 2006)
Previous versions of this data sheet contained
Advance or Preliminary Information. They were
distributed with incomplete characterization data.
This revision reflects these updates:
• Supported I
• ADC Conversion Clock selection to allow
• Operating Current (I
• Idle Current (I
• Power-Down Current (I
• I/O pin Input Specifications
• BOR voltage limits
• Watchdog Timer time-out limits
Revision E (December 2006)
This revision includes updates to the packaging
diagrams.
© 2008 Microchip Technology Inc.
(see Table 14-1)
200 kHz sampling rate (see Section 16.0 “12-bit
Analog-to-Digital Converter (ADC) Module”)
(see Table 20-5)
(see Table 20-6)
(see Table 20-7)
(see Table 20-8)
(see Table 20-11)
(see Table 20-21)
2
C Slave Addresses
IDLE
) Specifications
DD
REVISION HISTORY
) Specifications
PD
) Specifications
dsPIC30F2011/2012/3012/3013
Revision F (May 2008)
This revision reflects these updates:
• Added FUSE Configuration Register (FICD)
• Added Note 2 to Device Configuration Registers
• Updated Bit 10 in the UART2 Register Map (see
• Electrical Specifications:
• Additional minor corrections throughout the
details (see Section 17.7 “Device Configuration
Registers” and Table 17-8)
table (Table 17-8)
Table 15-2). This bit is unimplemented.
- Resolved TBD values for parameters DO10,
- 10-bit High-Speed ADC t
- Parameter OS65 (Internal RC Accuracy) has
- Parameter DC12 (RAM Data Retention
- Parameter D134 (Erase/Write Cycle Time)
- Removed parameters OS62 (Internal FRC
- Parameter OS63 (Internal FRC Accuracy)
- Updated Min and Max values and Conditions
document
DO16, DO20, and DO26 (see Table 20-9)
parameter (time to stabilize) has been
updated from 20 µs typical to 20 µs maximum
(see Table 20-37)
been expanded to reflect multiple Min and
Max values for different temperatures (see
Table 20-19)
Voltage) has been updated to include a Min
value (see Table 20-4)
has been updated to include Min and Max
values and the Typ value has been removed
(see Table 20-12)
Jitter) and OS64 (Internal FRC Drift) and
Note 2 from AC Characteristics (see
Table 20-18)
has been expanded to reflect multiple Min
and Max values for different temperatures
(see Table 20-18)
for parameter SY11 and updated Min, Typ,
and Max values and Conditions for
parameter SY20 (see Table 20-21)
PDU
timing
DS70139F-page 195