PIC16F747-I/ML Microchip Technology, PIC16F747-I/ML Datasheet - Page 260

IC PIC MCU FLASH 4KX14 44QFN

PIC16F747-I/ML

Manufacturer Part Number
PIC16F747-I/ML
Description
IC PIC MCU FLASH 4KX14 44QFN
Manufacturer
Microchip Technology
Series
PIC® 16Fr

Specifications of PIC16F747-I/ML

Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
36
Program Memory Size
7KB (4K x 14)
Program Memory Type
FLASH
Ram Size
368 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 14x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
44-QFN
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
368 B
Interface Type
AUSART, CCP, I2C, MSSP, SPI
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
36
Number Of Timers
8
Operating Supply Voltage
4 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
ICE2000, DM163022
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit
For Use With
XLT44QFN2 - SOCKET TRAN ICE 44QFN/40DIPAC164322 - MODULE SOCKET MPLAB PM3 28/44QFNI3DBF777 - BOARD DAUGHTER ICEPIC3444-1001 - DEMO BOARD FOR PICMICRO MCU
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC16F747-I/ML
Manufacturer:
MICRON
Quantity:
1 001
PIC16F7X7
44-Lead Plastic Thin Quad Flatpack (PT) 10x10x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
DS30498C-page 258
Number of Pins
Pitch
Pins per Side
Overall Height
Molded Package Thickness
Standoff §
Foot Length
Footprint (Reference)
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Pin 1 Corner Chamfer
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-026
Drawing No. C04-076
B
c
p
#leads=n1
Dimension Limits
E1
E
Units
(F)
CH
A2
E1
D1
n1
A1
A
E
D
B
n
p
L
c
n
MIN
2
1
.039
.037
.002
.018
.463
.463
.390
.390
.004
.012
.025
D1
0
5
5
L
CH x 45
INCHES
D
NOM
44
A1
.043
.039
.004
.024
.039
.472
.472
.394
.394
.006
.015
.035
.031
3.5
10
10
11
A
MAX
.047
.006
.030
.482
.482
.398
.398
.008
.017
.045
.041
15
15
7
(F)
MIN
11.75
11.75
1.00
0.95
0.05
0.45
1.00
9.90
9.90
0.09
0.30
0.64
0
5
5
MILLIMETERS*
 2004 Microchip Technology Inc.
NOM
44
12.00
12.00
10.00
10.00
0.15
0.80
1.10
1.00
0.10
0.60
0.38
0.89
3.5
10
10
11
A2
MAX
12.25
12.25
10.10
10.10
1.20
1.05
0.15
0.75
0.20
0.44
1.14
15
15
7

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