LPC1313FBD48,151 NXP Semiconductors, LPC1313FBD48,151 Datasheet - Page 45

• Manufacturer Part Number: LPC1313FBD48,151
• Description: IC MCU 32BIT 32KB FLASH 48LQFP
• Manufacturer: NXP Semiconductors
• Series: LPC13xxr

Specifications of LPC1313FBD48,151

• Program Memory Type: FLASH
• Program Memory Size: 32KB (32K x 8)
• Package / Case: 48-LQFP
• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 72MHz
• Connectivity: I²C, Microwire, SPI, SSI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number Of I /o: 42
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC13
• Core: ARM Cortex M3
• Data Bus Width: 32 bit
• Interface Type: I2C, UART
• Maximum Clock Frequency: 72 MHz
• Number Of Timers: 2
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: OM11041
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 8 Channel
• Cpu Family: LPC1000
• Device Core: ARM Cortex-M3
• Device Core Size: 32b
• Frequency (max): 72MHz
• Total Internal Ram Size: 8KB
• # I/os (max): 42
• Number Of Timers - General Purpose: 4
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 2V
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 48
• Package Type: LQFP
• Package: 48LQFP
• Family Name: LPC1000
• Maximum Speed: 72 MHz
• Number Of Programmable I/os: 42
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 568-4918 - KIT DEV FOR LPC1313622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4914; 935289651151

NXP Semiconductors
[8]
[9]
[10] A Fast-mode I
LPC1311_13_42_43
Product data sheet
Fig 22. I
The maximum t
t
SCL signal. If the clock stretches the SCL, the data must be valid by the set-up time before it releases the clock.
t
acknowledge.
This will automatically be the case if the device does not stretch the LOW period of the SCL signal. If such a device does stretch the
LOW period of the SCL signal, it must output the next data bit to the SDA line t
Standard-mode I
VD;ACK
SU;DAT
SDA
SCL
is the data set-up time that is measured with respect to the rising edge of SCL; applies to data in transmission and the
2
by a transition time (see UM10204). This maximum must only be met if the device does not stretch the LOW period (t
C-bus pins clock timing
70 %
30 %
S
2
t
C-bus device can be used in a Standard-mode I
f
HD;DAT
2
C-bus specification) before the SCL line is released. Also the acknowledge timing must meet this set-up time.
t
f
could be 3.45 μs and 0.9 μs for Standard-mode and Fast-mode but must be less than the maximum of t
70 %
30 %
1 / f
SCL
t
HD;DAT
70 %
30 %
70 %
30 %
All information provided in this document is subject to legal disclaimers.
t
SU;DAT
Rev. 3 — 10 August 2010
70 %
30 %
2
C-bus system but the requirement t
t
LOW
r(max)
t
HIGH
+ t
32-bit ARM Cortex-M3 microcontroller
70 %
30 %
SU;DAT
LPC1311/13/42/43
t
VD;DAT
= 1000 + 250 = 1250 ns (according to the
SU;DAT
= 250 ns must then be met.
© NXP B.V. 2010. All rights reserved.
002aaf425
LOW
VD;DAT
45 of 62
) of the
or