LPC2377FBD144,551 NXP Semiconductors, LPC2377FBD144,551 Datasheet - Page 38

IC ARM7 MCU FLASH 512K 144LQFP

LPC2377FBD144,551

Manufacturer Part Number
LPC2377FBD144,551
Description
IC ARM7 MCU FLASH 512K 144LQFP
Manufacturer
NXP Semiconductors
Series
LPC2300r
Datasheet

Specifications of LPC2377FBD144,551

Core Processor
ARM7
Core Size
16/32-Bit
Speed
72MHz
Connectivity
EBI/EMI, Ethernet, I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number Of I /o
104
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
58K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
144-LQFP
Processor Series
LPC23
Core
ARM7TDMI-S
Data Bus Width
32 bit
Data Ram Size
58 KB
Interface Type
CAN, I2S, ISP, UART, USB
Maximum Clock Frequency
72 MHz
Number Of Programmable I/os
104
Number Of Timers
4
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 8 Channel
On-chip Dac
10 bit, 1 Channel
Package
144LQFP
Device Core
ARM7TDMI-S
Family Name
LPC2000
Maximum Speed
72 MHz
For Use With
568-4310 - EVAL BOARD LPC2158 W/LCDMCB2370UME - BOARD EVAL MCB2370 + ULINK-MEMCB2370U - BOARD EVAL MCB2370 + ULINK2MCB2370 - BOARD EVAL NXP LPC2368/2378568-3999 - BOARD EVAL FOR LPC23 ARM MCU622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details
Other names
568-4411
935286019551
LPC2377FBD144-S

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LPC2377FBD144,551
Manufacturer:
NXP Semiconductors
Quantity:
10 000
NXP Semiconductors
8. Limiting values
Table 4.
In accordance with the Absolute Maximum Rating System (IEC 60134).
[1]
[2]
[3]
[4]
[5]
[6]
LPC2377_78
Product data sheet
Symbol
V
V
V
V
V
V
V
I
I
T
P
V
DD
SS
stg
DD(3V3)
DD(DCDC)(3V3)
DDA
i(VBAT)
i(VREF)
IA
I
tot(pack)
ESD
The following applies to the limiting values:
a) This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive
b) Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to V
Including voltage on outputs in 3-state mode.
Not to exceed 4.6 V.
The peak current is limited to 25 times the corresponding maximum current.
Dependent on package type.
Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 kΩ series resistor.
static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated
maximum.
otherwise noted.
Limiting values
Parameter
supply voltage (3.3 V)
DC-to-DC converter supply voltage
(3.3 V)
analog 3.3 V pad supply voltage
input voltage on pin VBAT
input voltage on pin VREF
analog input voltage
input voltage
supply current
ground current
storage temperature
total power dissipation (per package)
electrostatic discharge voltage
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 17 June 2010
Conditions
core and external
rail
for the RTC
on ADC related
pins
5 V tolerant I/O
pins; only valid
when the V
supply voltage is
present
other I/O pins
per supply pin
per ground pin
based on package
heat transfer, not
device power
consumption
human body
model; all pins
DD(3V3)
[1]
Single-chip 16-bit/32-bit microcontrollers
[2][3]
[2]
[4]
[4]
[5]
[6]
Min
3.0
3.0
−0.5
−0.5
−0.5
−0.5
−0.5
−0.5
-
-
−65
-
−2500
LPC2377/78
Max
3.6
3.6
+4.6
+4.6
+4.6
+5.1
+6.0
V
0.5
100
100
+150
1.5
+2500
DD(3V3)
© NXP B.V. 2010. All rights reserved.
+
SS
Unit
V
V
V
V
V
V
V
V
mA
mA
°C
W
V
unless
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