STM32F100RBH6B STMicroelectronics, STM32F100RBH6B Datasheet - Page 55
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STM32F100RBH6B
Manufacturer Part Number
STM32F100RBH6B
Description
MCU 32BIT ARM 128K FLASH 64LQFP
Manufacturer
STMicroelectronics
Series
STM32r
Datasheet
1.STM32F100R4T6B.pdf
(87 pages)
Specifications of STM32F100RBH6B
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
24MHz
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
DMA, PDR, POR, PVD, PWM, Temp Sensor, WDT
Number Of I /o
51
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 16x12b; D/A 2x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-LQFP
Processor Series
STM32F100x
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
8 KB
Interface Type
I2C, SPI, USART
Maximum Clock Frequency
24 MHz
Number Of Programmable I/os
51
Number Of Timers
6
Operating Supply Voltage
2 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWARM, EWARM-BL, MDK-ARM, RL-ARM, ULINK2
Development Tools By Supplier
STM32100B-EVAL
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 16 Channel
On-chip Dac
12 bit, 2 Channel
For Use With
STM32100B-EVAL - EVAL BOARD FOR STM32F100VBT6
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
497-10495
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
STM32F100RBH6B
Manufacturer:
STMicroelectronics
Quantity:
10 000
Company:
Part Number:
STM32F100RBH6BTR
Manufacturer:
STMicroelectronics
Quantity:
10 000
STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB
5.3.12
I/O current injection characteristics
As a general rule, current injection to the I/O pins, due to external voltage below V
above V
operation. However, in order to give an indication of the robustness of the microcontroller in
cases when abnormal injection accidentally happens, susceptibility tests are performed on a
sample basis during device characterization.
Functional susceptibilty to I/O current injection
While a simple application is executed on the device, the device is stressed by injecting
current into the I/O pins programmed in floating input mode. While current is injected into the
I/O pin, one at a time, the device is checked for functional failures.
The failure is indicated by an out of range parameter: ADC error above a certain limit (>5
LSB TUE), out of spec current injection on adjacent pins or other functional failure (for
example reset, oscillator frequency deviation).
The test results are given in
Table 33.
I
INJ
Symbol
DD
(for standard, 3 V-capable I/O pins) should be avoided during normal product
I/O current injection susceptibility
Injected current on OSC_IN32,
OSC_OUT32, PA4, PA5, PC13
Injected current on all FT pins
Injected current on any other pin
Description
Table 33
Doc ID 16455 Rev 6
Functional susceptibility
Negative
injection
-5
-0
-5
Electrical characteristics
injection
Positive
+0
+0
+5
SS
Unit
mA
or
55/87