STM32F100RBH6B STMicroelectronics, STM32F100RBH6B Datasheet - Page 72
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STM32F100RBH6B
Manufacturer Part Number
STM32F100RBH6B
Description
MCU 32BIT ARM 128K FLASH 64LQFP
Manufacturer
STMicroelectronics
Series
STM32r
Datasheet
1.STM32F100R4T6B.pdf
(87 pages)
Specifications of STM32F100RBH6B
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
24MHz
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
DMA, PDR, POR, PVD, PWM, Temp Sensor, WDT
Number Of I /o
51
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 16x12b; D/A 2x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-LQFP
Processor Series
STM32F100x
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
8 KB
Interface Type
I2C, SPI, USART
Maximum Clock Frequency
24 MHz
Number Of Programmable I/os
51
Number Of Timers
6
Operating Supply Voltage
2 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWARM, EWARM-BL, MDK-ARM, RL-ARM, ULINK2
Development Tools By Supplier
STM32100B-EVAL
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 16 Channel
On-chip Dac
12 bit, 2 Channel
For Use With
STM32100B-EVAL - EVAL BOARD FOR STM32F100VBT6
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
497-10495
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
STM32F100RBH6B
Manufacturer:
STMicroelectronics
Quantity:
10 000
Company:
Part Number:
STM32F100RBH6BTR
Manufacturer:
STMicroelectronics
Quantity:
10 000
Electrical characteristics
5.3.18
Table 46.
72/87
V
V
V
R
R
C
DAC_OUT
min
DAC_OUT
max
DAC_OUT
min
DAC_OUT
max
I
I
DNL
INL
DDVREF+
DDA
Symbol
DDA
REF+
SSA
LOAD
O
LOAD
(1)
(3)
(1)
(1)
(1)
(1)
(3)
(2)
(1)
Analog supply voltage
Reference supply voltage
Ground
Resistive load with buffer ON
Impedance output with buffer OFF
Capacitive load
Lower DAC_OUT voltage with buffer
ON
Higher DAC_OUT voltage with buffer
ON
Lower DAC_OUT voltage with buffer
OFF
Higher DAC_OUT voltage with buffer
OFF
DAC DC current consumption in
quiescent mode (Standby mode)
DAC DC current consumption in
quiescent mode (Standby mode)
Differential non linearity Difference
between two consecutive code-1LSB)
Integral non linearity (difference
between measured value at Code i
and the value at Code i on a line
drawn between Code 0 and last Code
1023)
DAC electrical specifications
DAC characteristics
Parameter
STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB
Doc ID 16455 Rev 6
2.4
2.4
0
5
0.2
Min
0.5
Typ
3.6
3.6
0
15
50
V
0.2
V
– 1LSB
220
380
480
±0.5
±2
±1
±4
Max
DDA
REF+
(1)
–
V
V
V
kΩ
kΩ
pF
V
V
mV
V
µA
µA
µA
LSB
LSB
LSB
LSB
Unit
V
V
When the buffer is OFF, the
Minimum resistive load between
DAC_OUT and V
1% accuracy is 1.5 MΩ
Maximum capacitive load at
DAC_OUT pin (when the buffer
is ON).
It gives the maximum output
excursion of the DAC.
It corresponds to 12-bit input
code (0x0E0) to (0xF1C) at
V
(0xEAB) at V
It gives the maximum output
excursion of the DAC.
With no load, worst code
(0xF1C) at V
terms of DC consumption on the
inputs
With no load, middle code
(0x800) on the inputs
With no load, worst code
(0xF1C) at V
terms of DC consumption on the
inputs
Given for the DAC in 10-bit
configuration
Given for the DAC in 12-bit
configuration
Given for the DAC in 10-bit
configuration
Given for the DAC in 12-bit
configuration
REF+
DDA
REF+
must always be below
= 3.6 V and (0x155) and
Comments
REF+
REF+
REF+
SS
= 3.6 V in
= 3.6 V in
= 2.4 V
to have a