MC56F8367VPYE Freescale Semiconductor, MC56F8367VPYE Datasheet - Page 150

• Manufacturer Part Number: MC56F8367VPYE
• Description: IC DSP 16BIT 60MHZ 160-LQFP
• Manufacturer: Freescale Semiconductor
• Series: 56F8xxxr

Specifications of MC56F8367VPYE

• Core Processor: 56800
• Core Size: 16-Bit
• Speed: 60MHz
• Connectivity: CAN, EBI/EMI, SCI, SPI
• Peripherals: POR, PWM, Temp Sensor, WDT
• Number Of I /o: 76
• Program Memory Size: 544KB (272K x 16)
• Program Memory Type: FLASH
• Ram Size: 18K x 16
• Voltage - Supply (vcc/vdd): 2.25 V ~ 3.6 V
• Data Converters: A/D 16x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 105°C
• Package / Case: 160-LQFP
• Cpu Family: 56F8xxx
• Device Core Size: 16b
• Frequency (max): 60MHz
• Interface Type: CAN/SCI/SPI
• Total Internal Ram Size: 36KB
• # I/os (max): 76
• Number Of Timers - General Purpose: 4
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 3V
• On-chip Adc: 4(4-chx12-bit)
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 105C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 160
• Package Type: LQFP
• Data Bus Width: 16 bit
• Processor Series: MC56F83xx
• Core: 56800E
• Numeric And Arithmetic Format: Fixed-Point
• Device Million Instructions Per Second: 60 MIPs
• Maximum Clock Frequency: 60 MHz
• Number Of Programmable I/os: 76
• Data Ram Size: 36 KB
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• Development Tools By Supplier: MC56F8367EVME
• Minimum Operating Temperature: - 40 C
• Package: 160LQFP
• Family Name: 56F8xxx
• Maximum Speed: 60 MHz
• Number Of Timers: 4
• For Use With: MC56F8367EVME - EVAL BOARD FOR MC56F83X
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Compliant

150
1. N/A since device captures data before it deasserts RD
2. If RWSS = RWSH = 0, and the chip select does not change, then RD does not deassert during back-to-back reads.
3. Substitute BMDAR for MDAR if there is no chip select
4. MDAR is active in this calculation only when the chip select changes.
Address Valid to WR Asserted
WR Width Asserted to WR
Deasserted
Valid Data Out Hold Time after WR
Deasserted
Valid Data Out Set-Up Time to WR
Deasserted
Valid Address after WR Deasserted
RD Deasserted to Address Invalid
Address Valid to RD Deasserted
Valid Input Data Hold after RD
Deasserted
RD Assertion Width
Address Valid to Input Data Valid
Address Valid to RD Asserted
RD Asserted to Input Data Valid
WR Deasserted to RD Asserted
RD Deasserted to RD Asserted
WR Deasserted to WR Asserted
RD Deasserted to WR Asserted
Data Out Valid to WR Asserted
Characteristic
Table 10-16 External Memory Interface Timing
Symbol
t
t
t
t
t
t
WRWR
t
WRRD
RDWR
t
t
t
t
t
ARDD
t
ARDA
t
RDRD
AWR
t
DWR
WAC
DOH
DOS
RDA
DRD
t
RDD
t
WR
RD
AD
56F8367 Technical Data, Rev. 8
Configuration
Wait States
WWS=0
WWS>0
WWS=0
WWS>0
WWS=0
WWS=0
WWS>0
WWS>0
WWS=0
WWS>0
WWS=0
WWS>0
-15.723
-20.642 1.25 + DCAOE
-13.120
-18.039 1.25 + DCAOE
-0.483
-2.076
-1.795
-0.094
-0.012
-9.321
-1.160
-8.631
-0.879
-2.086
-0.563
-8.315
-3.432
-1.780
-2.120
-2.603
-2.135
-1.608
-0.918
-0.096
0.279
0.084
0.00
D
2
0.75 + DCAOE
0.25 + DCAOE
0.25 + DCAEO
0.25 + DCAOE
0.25 + DCAEO
0.25 + DCAOE
0.25 + DCAEO
0.25 + DCAEO
0.75 + DCAEO
0.75 + DCAOE
N/A
0.50
0.00
0.50
0.50
0.00
1.00
1.00
1.00
0.00
1.00
0.00
1.00
0.50
M
0
1
WWSS, WWSH
RWSH, WWSS,
WWSH,RWSS
RWSS,RWSH
Wait States
WWS,WWSS
Freescale Semiconductor
RWSS,RWS
RWSS,RWS
RWSS,RWS
Controls
MDAR
MDAR
WWSS
WWSS
WWSH
WWSH
RWSH
RWSS
WWS
RWS
—
3, 4
3
Preliminary
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns