PIC18F2580-E/SP Microchip Technology, PIC18F2580-E/SP Datasheet - Page 465

• Manufacturer Part Number: PIC18F2580-E/SP
• Description: IC PIC MCU FLASH 16KX16 28DIP
• Manufacturer: Microchip Technology
• Series: PIC® 18Fr

Specifications of PIC18F2580-E/SP

• Program Memory Type: FLASH
• Program Memory Size: 32KB (16K x 16)
• Package / Case: 28-DIP (0.300", 7.62mm)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 25MHz
• Connectivity: CAN, I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, HLVD, POR, PWM, WDT
• Number Of I /o: 25
• Eeprom Size: 256 x 8
• Ram Size: 1.5K x 8
• Voltage - Supply (vcc/vdd): 4.2 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Processor Series: PIC18F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 1.5 KB
• Interface Type: SPI/I2C/MSSP/EUSART
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 25
• Number Of Timers: 4
• Maximum Operating Temperature: + 125 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DM163011, DV164136
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8-ch x 10-bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: DVA18XP280 - DEVICE ADAPTER 18F2220 PDIP 28LD
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

APPENDIX E:
A detailed discussion of the differences between the
mid-range MCU devices (i.e., PIC16CXXX) and the
enhanced devices (i.e., PIC18FXXX) is provided in
AN716, “Migrating Designs from PIC16C74A/74B to
PIC18C442 .” The changes discussed, while device
specific, are generally applicable to all mid-range to
enhanced device migrations.
This Application Note is available as Literature Number
DS00716.
© 2007 Microchip Technology Inc.
MIGRATION FROM
MID-RANGE TO
ENHANCED DEVICES
PIC18F2480/2580/4480/4580
Preliminary
APPENDIX F:
A detailed discussion of the migration pathway and
differences between the high-end MCU devices
(i.e., PIC17CXXX) and the enhanced devices
(i.e., PIC18FXXX) is provided in AN726, “PIC17CXXX
to PIC18CXXX Migration .” This Application Note is
available as Literature Number DS00726.
MIGRATION FROM
HIGH-END TO
ENHANCED DEVICES
DS39637C-page 463