PIC18F2580-E/SP Microchip Technology, PIC18F2580-E/SP Datasheet - Page 6
PIC18F2580-E/SP
Manufacturer Part Number
PIC18F2580-E/SP
Description
IC PIC MCU FLASH 16KX16 28DIP
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheets
1.PIC18F2221-ISO.pdf
(46 pages)
2.PIC18F4480-IPT.pdf
(490 pages)
3.PIC18F4480-IPT.pdf
(8 pages)
4.PIC18F4480-IPT.pdf
(6 pages)
5.PIC18F4480-IPT.pdf
(6 pages)
6.PIC18F2580-ESO.pdf
(483 pages)
Specifications of PIC18F2580-E/SP
Program Memory Type
FLASH
Program Memory Size
32KB (16K x 16)
Package / Case
28-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
25MHz
Connectivity
CAN, I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
25
Eeprom Size
256 x 8
Ram Size
1.5K x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
1.5 KB
Interface Type
SPI/I2C/MSSP/EUSART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
25
Number Of Timers
4
Maximum Operating Temperature
+ 125 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DM163011, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DVA18XP280 - DEVICE ADAPTER 18F2220 PDIP 28LD
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC18F2580-E/SP
Manufacturer:
Microchip Technology
Quantity:
135
- PIC18F2221-ISO PDF datasheet
- PIC18F4480-IPT PDF datasheet #2
- PIC18F4480-IPT PDF datasheet #3
- PIC18F4480-IPT PDF datasheet #4
- PIC18F4480-IPT PDF datasheet #5
- PIC18F2580-ESO PDF datasheet #6
- Current page: 6 of 483
- Download datasheet (9Mb)
PIC18F2480/2580/4480/4580
Table of Contents
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10.0 I/O Ports ................................................................................................................................................................................... 129
11.0 Timer0 Module ......................................................................................................................................................................... 147
12.0 Timer1 Module ......................................................................................................................................................................... 151
13.0 Timer2 Module ......................................................................................................................................................................... 157
14.0 Timer3 Module ......................................................................................................................................................................... 159
15.0 Capture/Compare/PWM (CCP) Modules ................................................................................................................................. 163
16.0 Enhanced Capture/Compare/PWM (ECCP) Module................................................................................................................ 173
17.0 Master Synchronous Serial Port (MSSP) Module .................................................................................................................... 187
18.0 Enhanced Universal Synchronous Receiver Transmitter (EUSART) ....................................................................................... 227
19.0 10-Bit Analog-to-Digital Converter (A/D) Module ..................................................................................................................... 247
20.0 Comparator Module.................................................................................................................................................................. 257
21.0 Comparator Voltage Reference Module ................................................................................................................................... 263
22.0 High/Low-Voltage Detect (HLVD)............................................................................................................................................. 267
23.0 ECAN Module........................................................................................................................................................................... 273
24.0 Special Features of the CPU .................................................................................................................................................... 343
25.0 Instruction Set Summary .......................................................................................................................................................... 361
26.0 Development Support............................................................................................................................................................... 411
27.0 Electrical Characteristics .......................................................................................................................................................... 415
28.0 DC and AC Characteristics Graphs and Tables ....................................................................................................................... 451
29.0 Packaging Information.............................................................................................................................................................. 453
Appendix A: Revision History............................................................................................................................................................. 461
Appendix B: Device Differences......................................................................................................................................................... 461
Appendix C: Conversion Considerations ........................................................................................................................................... 462
Appendix D: Migration from Baseline to Enhanced Devices.............................................................................................................. 462
Appendix E: Migration From Mid-Range to Enhanced Devices ......................................................................................................... 463
Appendix F: Migration From High-End to Enhanced Devices............................................................................................................ 463
Index .................................................................................................................................................................................................. 465
The Microchip Web Site ..................................................................................................................................................................... 477
Customer Change Notification Service .............................................................................................................................................. 477
Customer Support .............................................................................................................................................................................. 477
Reader Response .............................................................................................................................................................................. 478
PIC18F2480/2580/4480/4580 Product Identification System ............................................................................................................ 479
DS39637C-page 4
Device Overview .......................................................................................................................................................................... 7
Oscillator Configurations ............................................................................................................................................................ 23
Power-Managed Modes ............................................................................................................................................................. 33
Reset .......................................................................................................................................................................................... 41
Memory Organization ................................................................................................................................................................. 61
Flash Program Memory .............................................................................................................................................................. 95
Data EEPROM Memory ........................................................................................................................................................... 105
8 x 8 Hardware Multiplier.......................................................................................................................................................... 111
Interrupts .................................................................................................................................................................................. 113
Preliminary
© 2007 Microchip Technology Inc.
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